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首页> 美国卫生研究院文献>other >Influence of Substrate Moisture State and Roughness on Interface Microstructure and Bond Strength: Slant Shear vs. Pull-Off Testing
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Influence of Substrate Moisture State and Roughness on Interface Microstructure and Bond Strength: Slant Shear vs. Pull-Off Testing

机译：基材的水分状态和粗糙度对界面微结构和粘结强度的影响：斜切与拉拔测试

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摘要

There are conflicting views in the literature concerning the optimum moisture state for an existing substrate prior to the application of a repair material. Both saturated-surface-dry (SSD) and dry substrates have been found to be preferable in a variety of studies. One confounding factor is that some studies evaluate bonding of the repair material to the substrate via pull-off (direct tension) testing, while others have employed some form of shear specimens as their preferred testing configuration. Available evidence suggests that dry substrate specimens usually perform equivalently or better in shear testing, while SSD ones generally exhibit higher bond strengths when a pull-off test is performed, although exceptions to these trends have been observed. This paper applies a variety of microstructural characterization tools to investigate the interfacial microstructure that develops when a fresh repair material is applied to either a dry or SSD substrate. Simultaneous neutron and X-ray radiography are employed to observe the dynamic microstructural rearrangements that occur at this interface during the first 4 h of curing. Based on the differences in water movement and densification (particle compaction) that occur for the dry and SSD specimens, respectively, a hypothesis is formulated as to why different bond tests may favor one moisture state over the other, also dependent on their surface roughness. It is suggested that the compaction of particles at a dry substrate surface may increase the frictional resistance when tested under slant shear loading, but contribute relatively little to the bonding when the interface is submitted to pull-off forces. For maximizing bond performance, the fluidity of the repair material and the roughness and moisture state of the substrate must all be given adequate consideration.
机译：在文献中，关于在使用修补材料之前现有基材的最佳水分状态存在矛盾的看法。在各种研究中，已经发现饱和表面干燥（SSD）和干燥基材都是优选的。一个令人困惑的因素是，一些研究通过拉拔（直接拉力）测试评估了修补材料与基材的粘结性，而另一些研究则采用了某种形式的剪切试样作为其首选的测试配置。现有证据表明，干基体试样通常在剪切试验中表现相当或更好，而SSD试样在进行拉拔试验时通常表现出更高的粘结强度，尽管观察到了这些趋势的例外。本文应用了多种微观结构表征工具来研究将新鲜修补材料应用于干燥或SSD基材时产生的界面微观结构。同时进行中子和X射线照相以观察在固化的最初4小时内在此界面处发生的动态微结构重排。基于分别针对干燥和固态样品的水分运动和致密化（颗粒压实）的差异，提出了一个假设，即为什么不同的键合测试为什么偏向于一种水分状态而不是另一种水分状态，还取决于它们的表面粗糙度。建议在倾斜的剪切载荷下进行测试时，在干燥的基材表面上压实颗粒可能会增加摩擦阻力，但是当界面承受拉力时，对粘结的贡献相对较小。为了使粘结性能最大化，必须充分考虑修补材料的流动性以及基材的粗糙度和水分状态。

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