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Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS Devices

机译：包装和非气密封装技术适用于植入式mEms器件倒装芯片

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We report here a successful demonstration of a flip-chip packaging approach for a microelectromechanical systems (MEMS) device with in-plane movable microelectrodes implanted in a rodent brain. The flip-chip processes were carried out using a custom-made apparatus that was capable of the following: 1) creating Ag epoxy microbumps for first-level interconnect; 2) aligning the die and the glass substrate; and 3) creating non-hermetic encapsulation (NHE). The completed flip-chip package had an assembled weight of only 0.5 g significantly less than the previously designed wire-bonded package of 4.5 g. The resistance of the Ag bumps was found to be negligible. The MEMS micro-electrodes were successfully tested for its mechanical movement with microactuators generating forces of 450 μN with a displacement resolution of 8.8 μm/step. An NHE on the front edge of the package was created by patterns of hydrophobic silicone microstructures to prevent contamination from cerebrospinal fluid while simultaneously allowing the microelectrodes to move in and out of the package boundary. The breakdown pressure of the NHE was found to be 80 cm of water, which is significantly (4.5–11 times) larger than normal human intracranial pressures. Bench top tests and in vivo tests of the MEMS flip-chip packages for up to 75 days showed reliable NHE for potential long-term implantation.
机译：我们在此报告了具有在啮齿动物脑中的平面内可移动的微电极的微机电系统（MEMS）装置的倒装芯片包装方法的成功示范。使用能够下列的定制装置进行倒装芯片方法：1）为第一级互连产生Ag环氧微磁盘; 2）对准管芯和玻璃基板; 3）创造非密封封装（NHE）。完成的倒装芯片封装的组装重量仅为0.5g，显着小于先前设计的线键合封装为4.5g。发现AG凸块的抗性可忽略不计。 MEMS微电极成功地测试其机械运动，微致动器产生450μN的力，位移分辨率为8.8μm/步骤。通过疏水性硅氧烷微结构的图案产生封装前边缘的NHE，以防止脑脊液污染，同时允许微电极进出包装边界。发现NHE的击穿压力为80厘米的水，其比正常人体颅内压力大显着（4.5-11倍）。台式试验和MEMS倒装芯片封装的体内测试最多75天显示可靠的NHE，用于潜在的长期植入。

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