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首页> 美国卫生研究院文献>Polymers >Flexible Bandpass Filter Fabricated on Polyimide Substrate by Surface Modification and In Situ Self-Metallization Technique
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Flexible Bandpass Filter Fabricated on Polyimide Substrate by Surface Modification and In Situ Self-Metallization Technique

机译：通过表面改性和原位自金属化技术在聚酰亚胺衬底上制备柔性带通滤波器

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摘要

Polymer, especially polyimide (PI), is the best suitable substrate material for the design of flexible electronics. The compact silver can be reduced on the surface of PI films by surface modification and in situ self-metallization technique. The formed silver layers have good electrical and mechanical flexibility. A flexible bandpass filter on a PI flexible substrate by surface modification and in situ self-metallization technique at room temperature are presented in this work. Measured results show that the proposed flexible bandpass filter could achieve a fractional bandwidth of 80.8% with an insertion loss (IL) of less than 0.6 dB. The performance of the designed filter is almost constant under different bending, folding, and rolling conditions. The formed silver layers also present good adhesion with PI substrates. This technology provides an alternative approach for manufacturing flexible filters without high-temperature thermal annealing, costly equipment, and vacuum conditions.
机译：聚合物，尤其是聚酰亚胺（PI），是用于柔性电子产品设计的最合适的基材。可以通过表面改性和原位自金属化技术在PI膜的表面还原致密银。形成的银层具有良好的电气和机械柔韧性。这项工作提出了通过表面改性和室温下原位自金属化技术在PI柔性基板上的柔性带通滤波器。测量结果表明，所提出的柔性带通滤波器可以实现80.8％的分数带宽，且插入损耗（IL）小于0.6 dB。在不同的弯曲，折叠和滚动条件下，设计的过滤器的性能几乎恒定。形成的银层还表现出与PI基材的良好粘合性。该技术为制造柔性过滤器提供了另一种方法，而无需高温热退火，昂贵的设备和真空条件。

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