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首页> 美国卫生研究院文献>Materials >Effect of Acid Leaching Pre-Treatment on Gold Extraction from Printed Circuit Boards of Spent Mobile Phones
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Effect of Acid Leaching Pre-Treatment on Gold Extraction from Printed Circuit Boards of Spent Mobile Phones

机译：酸浸出预处理对废电机印刷电路板金提取的影响

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摘要

The effect of a preliminary acid leaching for the recovery of gold by thiourea from printed circuit boards (PCBs) of spent mobile phones, was investigated. Preliminary leaching is aimed to recover copper in the leachate that would compete with gold in the successive leaching of the residue with thiourea, thus preventing the formation of the gold-thiourea complex. Two hydrometallurgical routes were tested for the recovery of copper first, and gold after. The first one was based on a two-step leaching that utilizes sulfuric acid and hydrogen peroxide in the preliminary leaching and then thiourea for the recovery of gold in the successive leaching: A copper and gold recovery of 81% and 79% were obtained, respectively. In the second route, nitric acid was used: 100% of copper was recovered in the leachate and 85% of gold in the thiourea successive leaching. The main operative parameters, namely thiourea and ferric sulphate concentrations, leach time, liquid-solid ratio, and temperature were studied according to a factorial plan strategy. A flowsheet of the processes was proposed, and a mass balance of both routes was obtained. Finally, qualitative considerations on the technical and economic feasibility of the different routes were made.
机译：研究了初步酸浸出对废气手机的印刷电路板（PCB）硫脲回收黄金的效果。初步浸出旨在在渗滤液中恢复铜酸盐，这些渗滤液在与硫脲的残留物的连续浸出中竞争，因此防止了金 - 硫脲络合物的形成。测试了两条液压冶金途径，首先进行铜的回收，以及后面的金。第一个基于两步浸出，在初步浸出中使用硫酸和过氧化氢，然后在连续浸出中用于回收黄金：81％和79％的铜和金回收率。在第二次途径中，使用硝酸：在浸水液中回收100％的铜，在硫脲连续浸出中的85％的金。根据阶乘计划策略研究了主要的手术参数，即硫脲和硫酸铁浓度，浸出时间，液体比和温度。提出了该过程的流程，并获得了两条路线的质量平衡。最后，制定了关于不同路线的技术和经济可行性的定性考虑。

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