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首页> 美国卫生研究院文献>Materials >The Effect of Torsional Vibration in Longitudinal–Torsional Coupled Ultrasonic Vibration-Assisted Grinding of Silicon Carbide Ceramics
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The Effect of Torsional Vibration in Longitudinal–Torsional Coupled Ultrasonic Vibration-Assisted Grinding of Silicon Carbide Ceramics

机译：磁碳化硅陶瓷纵向扭转耦合超声振动磨削扭转振动的影响

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摘要

Rotary longitudinal–torsional coupled ultrasonic vibration-assisted grinding (LTUAG) is a new manufacturing method that can improve the grinding ability of silicon carbide ceramics. However, compared with longitudinal ultrasonic vibration-assisted grinding (LUAG), the role of torsional vibration in the grinding process is unclear. In this study, an effective method for measuring longitudinal–torsional coupled ultrasonic vibration amplitude and an experimental setup for measuring actual amplitude during grinding are proposed. The trajectory of the abrasive grains under the same grinding parameters and the same longitudinal amplitude during LTUAG and LUAG are analysed. Ultrasonic amplitude curves under the condition of tool rotation are then measured and analysed. Finally, the effect of torsional vibration on grinding force and surface roughness under the same grinding conditions is explained. Experimental analysis shows that the introduction of torsional vibration has little effect on the trajectory length and does not change the number of interference overlaps between abrasive grain tracks. Torsional vibration will only increase the cutting speed during grinding and reduce the undeformed chip thickness, which will reduce the grinding force and improve the surface roughness of LTUAG.
机译：旋转纵向耦合耦合超声波振动辅助研磨（LTUAG）是一种新的制造方法，可以提高碳化硅陶瓷的研磨能力。然而，与纵向超声波振动辅助研磨（Luag）相比，扭转过程中扭转振动的作用尚不清楚。在本研究中，提出了一种用于测量纵向耦合超声振动幅度和用于测量研磨期间的实际振幅的实验装置的有效方法。分析了在相同的研磨参数下磨粒和LTUAG期间相同的纵向振幅的轨迹。然后测量并分析在刀具旋转条件下的超声波振幅曲线。最后，解释了扭转振动对相同研磨条件下研磨力和表面粗糙度的影响。实验分析表明，扭转振动的引入对轨迹长度几乎没有影响，并且不会改变磨料晶轨之间的干扰次数。扭转振动只会在研磨过程中增加切割速度并降低未变形的芯片厚度，这将减少研磨力并改善LTUAG的表面粗糙度。

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