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首页> 美国卫生研究院文献>Sensors (Basel Switzerland) >Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board
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Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board

机译：灌封材料在电路板抗过载性能下的收缩拉伸应力影响分析

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摘要

In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed. However, the shrinkage tensile stress in the potting adhesive weakened the anti-overload ability of the circuit board. When there was a small amount of expansion stress in the potting adhesive, the overload resistance of the circuit board could be partially increased. From the analysis, it is indicated that a material with a certain expansion property, elasticity, and dense structure should be selected as the potting adhesive. This article provides a reference for improving the overload resistance of electronic devices.
机译：在本文中，研究了对电路板抗过载性能灌封材料的收缩张力应力的影响。首先，分析了共同灌封材料中的收缩抗拉应力现象，发现常用的灌封粘合剂显示出大的收缩特性。其次，建立了一个小实验，以验证灌封粘合剂的收缩拉伸应力会导致印刷电路板（PCB）变形，并且收缩应力与过载的加速方向相反。第三，分析了灌封粘合剂对PCB过载电阻的影响。然而，灌封粘合剂中的收缩拉伸应力削弱了电路板的防过载能力。当灌封粘合剂中存在少量的膨胀应力时，可以部分地增加电路板的过载电阻。从分析中，应选择具有一定的膨胀性，弹性和致密结构的材料作为灌封粘合剂。本文提供了提高电子设备过载电阻的参考。

著录项

  • 期刊名称 Sensors (Basel Switzerland)
  • 作者

    Lei Sun; Wenjun Yi;

  • 作者单位
  • 年(卷),期 2021(21),7
  • 年度 2021
  • 页码 2316
  • 总页数 12
  • 原文格式 PDF
  • 正文语种
  • 中图分类
  • 关键词

    机译：反过载;MEMS;灌封粘合剂;收缩应力;膨胀应力;

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