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首页> 美国卫生研究院文献>Polymers >Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis
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Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis

机译：基于内联介电分析固化高玻璃化转变温度环氧模塑化合物（EMC）的动力学建模

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摘要

We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was cured under isothermal temperatures close to general process conditions (165–185 °C). The material conversion was determined by measuring the ion viscosity. The change of the ion viscosity as a function of time and temperature was used to characterize the cross-linking behavior, following two separate approaches (model based and isoconversional). The determined kinetic parameters are in good agreement with those reported in the literature for EMCs and lead to accurate cure predictions under process-near conditions. Furthermore, the kinetic models based on dielectric analysis (DEA) were compared with standard offline differential scanning calorimetry (DSC) models, which were based on dynamic measurements. Many of the determined kinetic parameters had similar values for the different approaches. Major deviations were found for the parameters linked to the end of the reaction where vitrification phenomena occur under process-related conditions. The glass transition temperature of the inline molded parts was determined via thermomechanical analysis (TMA) to confirm the vitrification effect. The similarities and differences between the resulting kinetics models of the two different measurement techniques are presented and it is shown how dielectric analysis can be of high relevance for the characterization of the curing reaction under conditions close to series production.
机译：我们报告了基于具有高玻璃化转变温度（> 195℃）的市售环氧酚醛树脂模塑化合物的介电参数的固化表征，其适用于电子元件的直接包装。将树脂在接近一般工艺条件（165-185℃）的等温温度下固化。通过测量离子粘度来确定材料转化。以时间和温度的函数的离子粘度的变化用于表征两种单独的方法（基于模型和异组）的交联行为。确定的动力学参数与EMC的文献中报告的那些吻合吻合良好，并导致在近期条件下准确治愈预测。此外，基于介电分析（DEA）的动力学模型与标准离线差扫描量热法（DSC）模型进行了比较，其基于动态测量。许多确定的动力学参数对于不同方法具有类似的值。发现与在反应结束的参数相关的参数发现主要偏差，其中玻璃化现象发生在处理相关条件下。通过热机械分析（TMA）确定内联模塑部件的玻璃化转变温度，以确认玻璃化效果。提出了两种不同测量技术的所得动力学模型之间的相似性和差异，示出了如何在接近串联生产的条件下表征固化反应的介电分析如何高。

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