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Room-Temperature Metallic Fusion-Induced Layer-by-Layer Assembly for Highly Flexible Electrode Applications

机译：室温金属熔合诱导的逐层装配，用于高度柔性的电极应用

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摘要

To fabricate flexible electrodes, conventional silver (Ag) nanomaterials have been deposited onto flexible substrates, but the formed electrodes display limited electrical conductivity due to residual bulky organic ligands, and thus postsintering processes are required to improve the electrical conductivity. Herein, an entirely different approach is introduced to produce highly flexible electrodes with bulk metal-like electrical conductivity: the room-temperature metallic fusion of multilayered silver nanoparticles (NPs). Synthesized tetraoctylammonium thiosulfate (TOAS)-stabilized Ag NPs are deposited onto flexible substrates by layer-by-layer assembly involving a perfect ligand-exchange reaction between bulky TOAS ligands and small tris(2-aminoethyl) amine linkers. The introduced small linkers substantially reduce the separation distance between neighboring Ag NPs. This shortened interparticle distance, combined with the low cohesive energy of Ag NPs, strongly induces metallic fusion between the close-packed Ag NPs at room temperature without additional treatments, resulting in a high electrical conductivity of approximate to 1.60 x 10(5) S cm(-1) (bulk Ag: approximate to 6.30 x 10(5) S cm(-1)). Furthermore, depositing the TOAS-Ag NPs onto cellulose papers through this approach can convert the insulating substrates into highly flexible and conductive papers that can be used as 3D current collectors for energy-storage devices.
机译：为了制造柔性电极，常规的银（Ag）纳米材料已经沉积到柔性基板上，但是由于残留的庞大的有机配体，形成的电极显示出有限的导电性，因此需要后烧结工艺来改善导电性。在这里，引入了一种完全不同的方法来生产具有类似大块金属的导电性的高柔性电极：多层银纳米颗粒（NPs）的室温金属熔合。合成的四辛基硫代硫酸铵（TOAS）稳定的银纳米颗粒通过逐层组装而沉积在柔性基板上，该组装涉及大体积的TOAS配体与小的三（2-氨基乙基）胺接头之间的完美配体交换反应。引入的小接头大大减少了相邻Ag NP之间的分离距离。这种缩短的粒子间距离，再加上Ag NPs的低内聚能，在室温下无需进行额外处理即可强烈诱导密堆积的Ag NPs之间的金属融合，从而产生约1.60 x 10（5）S cm的高电导率（-1）（大块Ag：大约为6.30 x 10（5）S cm（-1））。此外，通过这种方法将TOAS-Ag NPs沉积到纤维素纸上可以将绝缘基板转换成高度柔性和导电的纸，可以用作能量存储设备的3D集电器。

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