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'Layer-Filter Threshold' Technique for Near-Infrared Laser Ablation inn Organic Semiconductor Device Processing

机译:有机半导体器件加工中近红外激光烧蚀的“层滤阈值”技术

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摘要

Although conventional laser ablation (CLA) method has widely been used in patterning of organic semiconductor thin films, its quality control still remains unsatisfied due to the ambiguous photochemical and photothermal processes. Based on industrial available near-infrared laser source, herein, a novel layer-filter threshold (LFT) technique is proposed, which involves the decomposition of targeted layer-filter and subsequent explosive evaporation process to purge away the upper layers instead o
机译:尽管传统的激光烧蚀(CLA)方法已广泛用于有机半导体薄膜的构图,但由于光化学和光热工艺的含糊不清,其质量控制仍不令人满意。本文基于工业上可用的近红外激光源,提出了一种新的层滤阈值(LFT)技术,该技术涉及目标层滤膜的分解和随后的爆炸蒸发过程,以清除上层物质,而不是将其去除。

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