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Topological-Structure Modulated Polymer Nanocomposites Exhibiting Highly Enhanced Dielectric Strength and Energy Density

机译：具有高度增强的介电强度和能量密度的拓扑结构调制聚合物纳米复合材料

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摘要

Dielectric materials with high electric energy densities and low dielectric losses are of critical importance in a number of applications in modern electronic and electrical power systems. An organic-inorganic 0-3 nano-composite, in which nanoparticles (O-dimensional) are embedded in a 3-dimensionally connected polymer matrix, has the potential to combine the high breakdown strength and low dielectric loss of the polymer with the high dielectric constant of the ceramic fillers, representing a promising approach to realize high energy densities. However, one significant drawback of the composites explored up to now is that the increased dielectric constant of the composites is at the expense of the breakdown strength, limiting the energy density and dielectric reliability. In this study, by expanding the traditional 0-3 nanocomposite approach to a multilayered structure which combines the complementary properties of the constituent layers, one can realize both greater dielectric displacement and a higher breakdown field than that of the polymer matrix. In a typical 3-layer structure, for example, a central nanocomposite layer of higher breakdown strength is introduced to substantially improve the overall breakdown strength of the multilayer-structured composite film, and the outer composite layers filled with large amount of high dielectric constant nanofillers can then be polarized up to higher electric fields, hence enhancing the electric displacement. As a result, the topological-structure modulated nanocomposites, with an optimally tailored nanomorphology and composite structure, yield a discharged energy density of 10 J/cm~3 with a dielectric breakdown strength of 450 kV mm~(-1), much higher than those reported from all earlier studies of nanocomposites.
机译：在现代电子和电力系统的许多应用中，具有高电能密度和低介电损耗的介电材料至关重要。有机-无机0-3纳米复合材料，其中纳米颗粒（O维）嵌入3维连接的聚合物基体中，具有将聚合物的高击穿强度和低介电损耗与高介电常数相结合的潜力陶瓷填料的常数，代表了实现高能量密度的一种有前途的方法。然而，迄今为止研究的复合材料的一个显着缺点是，复合材料的增加的介电常数是以击穿强度为代价的，从而限制了能量密度和介电可靠性。在这项研究中，通过将传统的0-3纳米复合材料方法扩展到结合了组成层的互补特性的多层结构，可以实现比聚合物基体更大的介电位移和更高的击穿场。例如，在典型的三层结构中，引入击穿强度较高的中央纳米复合材料层，以充分提高多层结构复合膜的整体击穿强度，并且外部复合层填充有大量高介电常数纳米填料然后可将其极化至更高的电场，从而增强电位移。结果，具有最佳定制纳米形态和复合结构的拓扑结构调制的纳米复合材料产生的放电能量密度为10 J / cm〜3，介电击穿强度为450 kV mm〜（-1），远高于纳米复合材料所有较早研究报告的那些。

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  • 来源
    《Advanced Functional Materials》 |2014年第21期|3172-3178|共7页
  • 作者

    Penghao Hu; Yang Shen; Yuhan Guan; Xuehui Zhang; Yuanhua Lin; Qiming Zhang; Ce-Wen Nan;

  • 作者单位

    School of Materials Science and Engineering State Key Lab of New Ceramics and Fine Processing Tsinghua University Beijing 100084, China,School of Chemical and Biological Engineering University of Science and Technology Beijing Beijing 100083, China;

    School of Materials Science and Engineering State Key Lab of New Ceramics and Fine Processing Tsinghua University Beijing 100084, China;

    School of Materials Science and Engineering State Key Lab of New Ceramics and Fine Processing Tsinghua University Beijing 100084, China;

    School of Materials Science and Engineering State Key Lab of New Ceramics and Fine Processing Tsinghua University Beijing 100084, China;

    School of Materials Science and Engineering State Key Lab of New Ceramics and Fine Processing Tsinghua University Beijing 100084, China;

    Department of Electrical Engineering and Materials Research Institute The Pennsylvania State University University Park PA 16802, USA;

    School of Materials Science and Engineering State Key Lab of New Ceramics and Fine Processing Tsinghua University Beijing 100084, China;

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