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Dissolution Behaviors and Applications of Silicon Oxides and Nitrides in Transient Electronics

机译：瞬态电子中氧化硅和氮化物的溶解行为及其应用

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摘要

Silicon oxides and nitrides are key materials for dielectrics and encapsulation layers in a class of silicon-based high performance electronics that has ability to completely dissolve in a controlled fashion with programmable rates, when submerged in bio-fluids and/or relevant solutions. This type of technology, referred to as "transient electronics", has potential applications in biomedical implants, environmental sensors, and other envisioned areas. The results presented here provide comprehensive studies of transient behaviors of thin films of silicon oxides and nitrides in diverse aqueous solutions at different pH scales and temperatures. The kinetics of hydrolysis of these materials depends not only on pH levels/ion concentrations of solutions and temperatures, but also on the morphology and chemistry of the films, as determined by the deposition methods and conditions. Encapsulation strategies with a combination of layers demonstrate enhancement of the lifetime of transient electronic devices, by reducing water/vapor permeation through the defects.
机译：氧化硅和氮化硅是一类基于硅的高性能电子产品中介电层和封装层的关键材料，当浸入生物流体和/或相关解决方案中时，它们能够以可编程的速率以受控的方式完全溶解。这种类型的技术称为“瞬态电子”，在生物医学植入物，环境传感器和其他预想的领域中具有潜在的应用。此处提供的结果提供了在不同pH值和温度下在各种水溶液中氧化硅和氮化硅薄膜瞬态行为的全面研究。这些材料的水解动力学不仅取决于溶液的pH值/离子浓度和温度，还取决于沉积方法和条件所确定的薄膜的形态和化学性质。具有多层组合的封装策略可通过减少水/蒸气透过缺陷的渗透来提高瞬态电子设备的使用寿命。

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  • 来源
    《Advanced Functional Materials》 |2014年第28期|4427-4434|共8页
  • 作者

    Seung-Kyun Kang; Suk-Won Hwang; Huanyu Cheng; Sooyoun Yu; Bong Hoon Kim; Jae-Hwan Kim; Yonggang Huang; John A. Rogers;

  • 作者单位

    Department of Materials Science and Engineering Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, IL 61801, USA;

    Department of Materials Science and Engineering Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, IL 61801, USA;

    Department of Mechanical Engineering Civil and Environmental Engineering Center for Engineering and Health and Skin Disease Research Center Northwestern University Evanston, IL 60208, USA;

    Department of Chemical and Biomolecular Engineering University of Illinois at Urbana-Champaign Urbana, IL 61801, USA;

    Department of Materials Science and Engineering Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, IL 61801, USA;

    Department of Materials Science and Engineering Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, IL 61801, USA;

    Department of Mechanical Engineering Civil and Environmental Engineering Center for Engineering and Health and Skin Disease Research Center Northwestern University Evanston, IL 60208, USA;

    Department of Materials Science and Engineering Chemistry, Mechanical Science and Engineering Electrical and Computer Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, IL 61801, USA;

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