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Theoretical and Experimental Studies of Bending of Inorganic Electronic Materials on Plastic Substrates

机译：塑料基板上无机电子材料弯曲的理论和实验研究

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摘要

This paper describes materials and mechanics aspects of bending in systems consisting of ribbons and bars of single crystalline silicon supported by sheets of plastic. The combined experimental and theoretical results provide an understanding for the essential behaviors and for mechanisms associated with layouts that achieve maximum bendability. Examples of highly bendable silicon devices on plastic illustrate some of these concepts. Although the studies presented here focus on ribbons and bars of silicon, the same basic considerations apply to other implementations of inorganic materials on plastic substrates, ranging from amorphous or polycrystalline thin films, to collections of nanowires and nanoparticles. The contents are, as a result, relevant to the growing community of researchers interested in the use of inorganic materials in flexible electronics.
机译：本文介绍了在由塑料片支撑的单晶硅带和条组成的系统中弯曲的材料和力学方面。结合实验和理论结果，可以了解基本行为以及与实现最大可弯曲性的布局相关的机制。塑料上高度可弯曲的硅器件的示例说明了其中一些概念。尽管此处介绍的研究集中在硅带和硅条上，但相同的基本考虑也适用于塑料基板上无机材料的其他实现方式，从无定形或多晶薄膜到纳米线和纳米粒子的集合。结果，这些内容与对柔性电子中使用无机材料感兴趣的不断增长的研究人员群体有关。

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