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首页> 外文期刊>Advanced Functional Materials >Localized electrochemical deposition of copper monitored using real-time X-ray microradiography
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Localized electrochemical deposition of copper monitored using real-time X-ray microradiography

机译：使用实时X射线显微照相术监测铜的局部电化学沉积

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摘要

We have developed a novel strategy for localized electrochemical deposition (LECD) to improve both the lateral resolution of the process and the porosity of the fabricated high-aspect-ratio microstructures. The strategy is based on accurately controlling the motion of the anode. Its implementation is made possible by the use of coherent, synchrotron X-ray microradiography with high time and lateral resolution, enabling the observation of the copper LECD process in real time. Microradiography reveals a deposition mechanism that differs as a function of the distance between the electrode (anode) and the growing structure (cathode). Specifically, the interplay of migration and diffusion of the metal ions in the baths affects the deposition rate and the characteristics of the fabricated structure. This enables us to optimize the anode motion control and greatly improve the quality of the structure grown.
机译：我们已经开发了一种用于局部电化学沉积（LECD）的新策略，以提高过程的横向分辨率和制造的高纵横比微结构的孔隙率。该策略基于精确控制阳极的运动。通过使用具有高时间和横向分辨率的相干，同步加速器X射线显微照相术，可以实现其实现，从而可以实时观察铜LECD过程。显微放射学揭示了一种沉积机理，该机理根据电极（阳极）和生长结构（阴极）之间的距离而不同。具体地，金属离子在浴中的迁移和扩散的相互作用影响沉积速率和所制造的结构的特性。这使我们能够优化阳极运动控制并大大提高所生长结构的质量。

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