Self-assembly process to integrate and connect semiconductor dies on surfaces with single-angular orientation and contact-pad registration

Zheng W; Jacobs HO

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Self-assembly process to integrate and connect semiconductor dies on surfaces with single-angular orientation and contact-pad registration

机译：自组装过程以单角取向和接触焊盘对齐方式集成和连接表面上的半导体管芯

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A directed self-assembly process to batch assemble differently sized components with single angular orientation on surfaces is demonstrated. This process employs "two-element docking sites" on the substrate that contain alignment pedestals and solder-coated areas that are designed according to the size and shape of the components. The directed assembly of one hundred silicon blocks (see figure), 900 and 500 gm in size, is demonstrated with 19 mu m lateral and 0.3 degrees angular contact-pad registration accuracy.

机译：演示了一种定向自组装过程，该过程可以在表面上以单个角度定向批量组装大小不同的组件。此过程在基板上采用“两元素对接位置”，其中包含根据组件的大小和形状设计的对准基座和焊料涂层区域。演示了100个硅块（分别为900和500 gm）的定向组装，横向组装厚度为19μm，角接触垫对准角度为0.3度。

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来源
《Advanced Materials》 |2006年第11期|p. 1387-1392|共6页
作者
Zheng W; Jacobs HO;
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作者单位

Univ Minnesota, Dept Elect & Comp Engn, Minneapolis, MN 55455 USA;

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原文格式 PDF
正文语种 eng
中图分类工程材料学;
关键词
CAPILLARY FORCES; FABRICATION; DEVICE;

机译：毛细管力;制造;设备;

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机译：多芯片自组装技术，用于先进的晶片对晶片3D集成，以精确地将批处理中的已知良好管芯对准
2. Orientational Organization of Organic Semiconductors within Periodic Nanoscale Silica Channels: Modification of Fluorophore Photophysics through Hierarchical Self-Assembly [J] . Li LL, Sun H, Bai YC, Chemistry: A European journal . 2009,第18期

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3. Atomically controlled CVD processing of group IV semiconductors for ultra-large-scale integrations - IOPscience [J] . Junichi Murota, Masao Sakuraba, Bernd Tillack Advances in Natural Sciences: Nanoscience and Nanotechnology . 2012,第2期

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4. Angular Orientation-Specific Directed Self-assembly and Integration of Ultra Small Dies [C] . Robert Knuesel, Shameek Bose, Wei Zheng, Nano Science and Technology Institute(NSTI) Nanotechnology Conference and Trade Show(NSTI Nanotech 2007) vol.3; 20070520-24; Santa Clara,CA(US) . 2007

机译：角取向特定的定向自组装和超小型模具的集成
5. Self-Assembly and Self-Tiling of Miniaturized Semiconductor Dies Across Length Scales and 3D Topologies. [D] . Knuesel, Robert John. 2011

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7. Self-organization at Semiconductor Surfaces. Self-assembly and Self-organization in Semiconductor Growth. InGaAs Quantum Disks Self-organized on GaAs(311)B. [O] . Jiro TEMMYO, Toshiaki TAMAMURA 1998

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Self-assembly process to integrate and connect semiconductor dies on surfaces with single-angular orientation and contact-pad registration

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