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首页> 外文期刊>Advances in technology of materials and materials processing journal >FABRICATION OF CHEMICAL MECHANICAL POLISHING (CMP) PAD DRESSER BY USING CHEMICAL REACTION BETWEEN DIAMOND ABRASIVE GRAINS AND TITANIUM MATRIX
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FABRICATION OF CHEMICAL MECHANICAL POLISHING (CMP) PAD DRESSER BY USING CHEMICAL REACTION BETWEEN DIAMOND ABRASIVE GRAINS AND TITANIUM MATRIX

机译：利用金刚石磨粒与钛基体之间的化学反应制备化学机械抛光（CMP）抛光粉

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摘要

Typical chemical mechanical polishing (CMP) pad dresser consists of diamond grains bound to a metallic substrate normally by a nickel electroplating layer. The main problem with traditional CMP pad dressers is the drop out of diamond caused by corrosion in the nickel plating layer. This work proposes to induce a chemical bonding between diamond and a titanium substrate by utilization of pulsed electric current sintering (PECS). One hundred diamond grains on titanium discs were PECSed at different sintering temperature and time. The number of retained grains after sintering increase with increase of sintering temperature or period. XRD shows TiC, TiB, Ti_2N and TiN on the titanium surface. It is considered that TiC layer between diamond and titanium substrate is a key material for bonding of diamond grains. TiC layer of 3 μm was formed by diffusion of carbon in Ti.
机译：典型的化学机械抛光（CMP）抛光垫修整器通常由镍电镀层结合到金属基材上的金刚石晶粒组成。传统的CMP抛光垫修整器的主要问题是由镍镀层的腐蚀引起的金刚石脱落。这项工作建议通过利用脉冲电流烧结（PECS）诱导金刚石和钛基底之间的化学键合。在不同的烧结温度和时间下对钛圆盘上的一百个金刚石晶粒进行PECS处理。烧结后残留的晶粒数随着烧结温度或烧结周期的增加而增加。 XRD显示钛表面上的TiC，TiB，Ti_2N和TiN。认为在金刚石和钛基底之间的TiC层是用于结合金刚石晶粒的关键材料。通过碳在Ti中的扩散形成3μm的TiC层。

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