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首页> 外文期刊>IEEE Transactions on Aerospace and Electronic Systems >Multimode GaAs chip-set for new S-band satellite TT&C transponders
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Multimode GaAs chip-set for new S-band satellite TT&C transponders

机译：用于新型S波段卫星TT＆C应答器的多模GaAs芯片组

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摘要

This paper presents a production-oriented chip-set to be used as the circuitry needed to implement the necessary RF functionalities of a new generation of S-band satellite transponders for telemetry tacking and control (TT&C) applications. The RF hardware section integration is achieved by means of a customized chip-set of just four multi-chip multifunction MMIC (MCMM) modules. The functions contained in the monolithic microwave integrated circuits (MMICs) include the active circuits needed for the front-end low noise amplifier (LNA), the RF and IF converters, all the variable gain amplifiers (VGAs), the voltage controlled oscillator (VCO) for both transmit and receive sections, the frequency prescaler and multiplier needed to synthesize the frequency plan as well as the local oscillator (LO) amplifiers. The selected technology is GaAs, mainly due to its radiation hardness, essential for aerospace applications, and good reliability. Issues such as suitable circuit topology, efficient dc biasing, circuit area minimization, cost-oriented system design and advanced packaging techniques have been addressed during the design. Measurements and yield results from the manufactured circuits will be presented showing that these components, even though especially designed in the frame of the GALILEO TT&C transponder predevelopment, are suitable for a variety of missions, from deep space to near Earth, including spread-spectrum transponders with precision ranging function.
机译：本文提出了一种面向生产的芯片组，该芯片组将用作实现新一代遥测定位和控制（TT＆C）应用的S波段卫星转发器必要的RF功能所需的电路。 RF硬件部分的集成是通过仅包含四个多芯片多功能MMIC（MCMM）模块的定制芯片组来实现的。单片微波集成电路（MMIC）中包含的功能包括前端低噪声放大器（LNA），RF和IF转换器，所有可变增益放大器（VGA），压控振荡器（VCO）所需的有源电路。 ）对于发射和接收部分，综合频率计划所需的频率预分频器和乘法器以及本地振荡器（LO）放大器。选择的技术是砷化镓，主要是因为它的辐射硬度，对于航空航天应用是必不可少的以及良好的可靠性。设计过程中已解决了诸如合适的电路拓扑，有效的直流偏置，最小化电路面积，面向成本的系统设计以及先进的封装技术等问题。将显示制造电路的测量结果和成品率结果，表明这些组件即使在GALILEO TT＆C应答器预开发框架中进行了专门设计，也适用于从深空到近地的各种任务，包括扩频应答器具有精确的测距功能。

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