Achieving higher levels of electronic integration throughsystem-on-chip

Dent D.J.

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Achieving higher levels of electronic integration throughsystem-on-chip

机译：通过片上系统实现更高级别的电子集成

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All aerospace vehicles have the common constraint of limited space for the electronic systems. The challenge has always been how to pack effective electronic systems into the space available. Higher levels of electronic integration can give a competitive advantage; for example, by providing extra channels in a communications satellite thereby increasing revenue to the operator. Today's deep sub-micron manufacturing processes for integrated electronics offer an opportunity for a step change for electronic functionality that can be packaged in a given space. This technology makes possible, for the first time, a true system-on-chip approach to electronic systems, which is already being exploited by the commercial sector in products such as the mobile telephone

机译：所有的航空航天器都有共同的限制，即电子系统的空间有限。挑战一直是如何将有效的电子系统包装到可用空间中。更高水平的电子集成可以带来竞争优势；例如，通过在通信卫星中提供额外的频道，从而为运营商增加收入。如今，用于集成电子产品的深亚微米制造工艺为可以在给定空间中封装的电子功能逐步改变提供了机会。这项技术首次为电子系统提供了一种真正的片上系统方法，这种方法已被商业领域广泛应用于诸如移动电话之类的产品中。

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《IEEE Aerospace and Electronic Systems Magazine》 |2001年第10期|p.36-41|共6页
作者
Dent D.J.;
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原文格式 PDF
正文语种 eng
中图分类航空;
关键词
application specific integrated circuits; avionics; field programmable gate arrays; microprocessor chips; multichip modules; radiation hardening (electronics); reconfigurable architectures; space vehicle electronics; ASIC; COTS; FPGA; MCM-D; aerospace vehicles; elect;

机译：专用集成电路;航空电子;现场可编程门阵列;微处理器芯片;多芯片模块;辐射硬化（电子）;可重构架构;航天器电子产品;ASIC;COTS;FPGA;MCM-D;航天器;电子;

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Achieving higher levels of electronic integration throughsystem-on-chip

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