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首页> 外文期刊>American journal of applied sciences >Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly
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Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly

机译：厚度-温度线性梯度不同的均匀温度对双材料组件界面应力的影响

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Problem statement: The thermal mismatch induced interfacial stresses are one of the major reliability issues in electronic packaging and composite materials. Consequently an understanding of the nature of the interfacial stresses under different temperature conditions is essential in order to eliminate or reduce the risk of structural and functional failure. Approach: In this analysis, a model was proposed for the shearing and peeling stresses occurring at the interface of two bonded dissimilar materials with the effect of different uniform temperatures in the layers. The model was then upgraded by accounting thickness wise linear temperature gradients in the layers using two temperature drop ratios. The upgraded models were then compared with the existing uniform temperature model. The proposed model can be seen as a more generalized form to predict interfacial stresses at different temperature conditions that may occur in the layers. Results: The results were presented for an electronic bi-material package consisting of die and die-attach. Conclusion: The numerical simulation is in a good matching agreement with analytical results.
机译：问题陈述：热失配引起的界面应力是电子包装和复合材料中的主要可靠性问题之一。因此，必须了解不同温度条件下的界面应力的性质，以消除或减少结构和功能失效的风险。方法：在此分析中，提出了一个模型，用于在两种粘结的异种材料的界面处发生的剪切应力和剥离应力，各层中的均匀温度不同。然后通过使用两个降温比计算各层的厚度方向线性温度梯度来升级模型。然后将升级后的模型与现有的均匀温度模型进行比较。可以将所提出的模型看作是一种更通用的形式，以预测可能在各层中发生的不同温度条件下的界面应力。结果：给出了由管芯和管芯连接组成的电子双材料封装的结果。结论：数值模拟与分析结果吻合良好。

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