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首页> 外文期刊>Applied Computational Electromagnetics Society journal >An Interdigital FSS based Dual Channel UWB-MIMO Antenna Array for System-in-Package Applications
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An Interdigital FSS based Dual Channel UWB-MIMO Antenna Array for System-in-Package Applications

机译：基于叉指FSS的双通道UWB-MIMO天线阵列，用于系统级封装应用

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摘要

In this paper, a miniaturized, dual channel Multiple Input Multiple Output (MIMO) antenna array is presented for Ultra Wideband applications. The array configuration is well suited for 3-D system-in-package applications. MIMO antennas are reported in two different configurations, i.e., back-to-back and orthogonal/comer. The array is designed on an FR-4 substrate of thickness 1 mm and compact dimensions of 40 mm x 35 mm. An Interdigital FSS based decoupling structure is analyzed and deployed to reduce mutual coupling between array ports. Simulated and measured results show that an isolation better than 20 dB is achieved over most of the band. More importantly, other performance criteria such as envelope correlation coefficient, total active reflection coefficient, channel capacity loss and gain also indicate that the proposed array is a potential candidate for UWBMIMO applications.
机译：本文针对超宽带应用提出了一种小型化的双通道多输入多输出（MIMO）天线阵列。阵列配置非常适合3D封装系统应用。 MIMO天线被报告为两种不同的配置，即背对背和正交/角。该阵列设计在厚度为1毫米，紧凑尺寸为40毫米x 35毫米的FR-4基板上。分析并部署了基于叉指式FSS的去耦结构，以减少阵列端口之间的相互耦合。仿真和测量结果表明，在大多数频带上，隔离度均优于20 dB。更重要的是，其他性能标准（例如包络相关系数，总有源反射系数，信道容量损耗和增益）也表明，所提出的阵列是UWBMIMO应用的潜在候选者。

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