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首页> 外文期刊>Applied Computational Electromagnetics Society journal >Field-to-Wire Coupling Model for Wire Bundles with Strongly Non-uniform Path
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Field-to-Wire Coupling Model for Wire Bundles with Strongly Non-uniform Path

机译：具有强不均匀路径的电线捆绑的现场到线耦合模型

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摘要

This paper presents a field-to-wire coupling model for wire bundles with strongly non-uniform path. Previous studies on multi-conductor transmission lines (MTL) are mainly confined to uniform or weakly non-uniform path, which is sometimes not the case in practice. In this paper, the external and internal characteristics of the wire bundle are decomposed by a mode transformation method, of which the advantage is the transformation matrices do not vary with the non-uniform path. The external characteristics correspond to common-mode (CM) components, modeled as an equivalent single wire running in the same path with the bundle above the reference ground. The internal characteristics correspond to differential-mode (DM) components, modeled as a uniform MTL system composed of the original wires in the bundle. In this way, the effects of the non-uniform path and the external field only exist in the CM model. Mode conversion caused by the dielectric coating and terminals is modeled with equivalent circuits. The proposed model is validated with a bundle of curved wires above a PCB board.
机译：本文介绍了具有强烈非均匀路径的线束的励磁耦合模型。以前关于多导体传输线（MTL）的研究主要被限制在均匀或弱均匀的路径上，这有时不是实践的情况。在本文中，电线束的外部和内部特性通过模式变换方法分解，其中优点是变换矩阵不会随着非均匀路径而变化。外部特性对应于共模（CM）组件，以与参考地上的束在相同的路径中进行建模。内部特性对应于差分模式（DM）组件，其模拟为由束中的原始线组成的均匀MTL系统。以这种方式，在CM模型中仅存在非均匀路径和外部场的效果。由介电涂层和端子引起的模式转换用等效电路建模。所提出的模型用PCB板上的一束弯曲线验证。

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