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Modeling and numerical study of thermal-compression bonding in the packaging process using NCA

机译：使用NCA进行包装过程中热压粘合的建模和数值研究

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摘要

Packaging technology used in liquid crystal displays (LCDs) faces the critical issues such as high density interconnects, thinner packaging size, and environmental safety. In order to reduce the packaging size, driver integrated circuit (IC) chips are directly attached to LCD panels using flip chip technology with adhesives, which is called chip on glass (COG) packaging processes. To investigate the effects of the bonding force and bonding temperature on the flip chip thermal-compression packaging, this study established a compression model to analyze the flip chip packaging processes with non-conductive adhesives (NCAs). The plastic deformation of bumps and the NCA flow dynamics between chip and substrate were taken into account in this model. The gap height, bump deformation, bump contact area, and residual stresses after bonding can be estimated with this model. According to the simulation in this work, the best tactic for the flip chip packaging process using NCA is bonded at a lower temperature. This reduces the maximum warpage and only slightly decreases the average compressive residual stress in the bottom of bumps. A larger bonding force results in a larger bump contact area with the substrate, but has a lower compressive residual stress at the contact areas. The bonding force during the flip chip thermal bonding process will affect the contact resistance and reliability of packaging at the same time.
机译：液晶显示器（LCD）中使用的封装技术面临着诸如高密度互连，更薄的封装尺寸和环境安全之类的关键问题。为了减小包装尺寸，使用倒装芯片技术和粘合剂将驱动器集成电路（IC）芯片直接连接到LCD面板，这被称为玻璃上芯片（COG）封装工艺。为了研究键合力和键合温度对倒装芯片热压封装的影响，本研究建立了压缩模型，以分析使用非导电粘合剂（NCA）的倒装芯片封装工艺。该模型考虑了凸块的塑性变形和芯片与基板之间的NCA流动动力学。间隙高度，凸块变形，凸块接触面积和键合后的残余应力可通过该模型估算。根据这项工作中的模拟，使用NCA进行倒装芯片封装工艺的最佳策略是在较低温度下进行的。这减少了最大翘曲，并且仅稍微降低了凸块底部的平均压缩残余应力。较大的结合力导致与基板的较大凸点接触面积，但在接触区域处具有较低的压缩残余应力。倒装芯片热粘合过程中的粘合力将同时影响接触电阻和封装的可靠性。

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