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A study on 3-D stress distributions in the bi-adhesively bonded T-joints

机译：双胶T型接头中3-D应力分布的研究

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摘要

In this study, the normal (σ_x,σ_y,σ_z) and shear stress (τ_(xy),τ(yz)τ(zx)) distributions occurring in a bi-adhesively bonded T-joint with was investigated via a non-linear three dimensional finite element analysis. For this purpose, first of all, using 2024-T3 aluminum alloy as the adherend and the support, a two-part paste (DP 460) and a film type (SBT 9244) as adhesive, two different types of T-joint samples (single-adhesively bonded T-joint and bi-adhesively bonded T-joint) were produced for experimental studies. After experimental studies on the three different T-joint types were conducted, stress analyses in the T-joints were performed with a three-dimensional finite element analysis by considering the geometrical non-linearity and the material non-linearities of the adhesive (DP460 and SBT9244) and adherend (AA2024-T3). Finally, for a given adherend, the lower the stiffness of the adhesive used in the overlap, the lower the stress concentration, leading to potentially higher joint strength. The use of relatively low stiffness adhesives at the ends of the overlap in a bi-adhesive can decrease the stress concentration and, therefore, potentially lead to higher joint strength.
机译：在这项研究中，通过非线性研究了在双胶结T型接头中出现的正态（σ_x，σ_y，σ_z）和切应力（τ_（xy），τ（yz）τ（zx））分布。三维有限元分析。为此，首先，使用2024-T3铝合金作为被粘物和支撑物，使用两部分式糊剂（DP 460）和薄膜类型（SBT 9244）作为粘合剂，使用两种不同类型的T型接头样品（为实验研究生产了单胶粘的T型接头和双胶粘的T型接头。在对三种不同的T型接头进行了实验研究后，考虑了粘合剂的几何非线性和材料非线性，利用三维有限元分析对T型接头进行了应力分析。 SBT9244）和被粘物（AA2024-T3）。最后，对于给定的被粘物，重叠中使用的粘合剂的硬度越低，应力集中就越低，从而导致潜在的更高的接合强度。在双胶粘剂的搭接端使用相对较低硬度的胶粘剂可以降低应力集中，因此有可能导致较高的接合强度。

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