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Remarkable thermal conductivity reduction in metal-semiconductor nanocomposites

机译：金属-半导体纳米复合材料的导热系数显着降低

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摘要

Remarkable reduction in thermal conductivity, by ～2 orders of magnitude compared to the bulk counterpart, is observed in a metal-semiconductor nanocomposite consisting of silver (Ag) and silicon (Si) nanostructures. The variation of thermal conductivity with temperature and with volume fraction of metallic inclusion exhibits counter-intuitive behavior. Contrary to bulk composites, thermal conductivity decreases with the increase in the volume fraction of Ag nanocrystals (at least till 0.067 experimented) and increases with temperature over the range of 303-473 K. This remarkable reduction in the thermal conductivity of the nanocomposite is due to the interplay of size-dependent reduction in thermal conductivity of the individual nanostructures, increased contribution of phonon scattering at the interfaces between nanoparticles, and electron-phonon coupling inside metallic nanocrystals and across metal-semiconductor interface. Such hybrid metal-semiconductor nanostructures with reduced thermal conductivity offer immense potential for developing high efficiency thermoelectric materials.
机译：在由银（Ag）和硅（Si）纳米结构组成的金属-半导体纳米复合物中，与本体相比，导热系数显着降低了约2个数量级。导热系数随温度和金属夹杂物体积分数的变化表现出违反直觉的行为。与块状复合材料相反，在303-473 K范围内，热导率随Ag纳米晶体体积分数的增加而降低（至少试验到0.067），并随温度的升高而升高。这是由于纳米复合材料的热导率显着降低各个纳米结构的导热系数的尺寸依赖性减小，声子在纳米颗粒之间的界面处的声子散射的贡献以及金属纳米晶体内部和整个金属-半导体界面之间的电子-声子耦合之间的相互作用。具有降低的热导率的这种杂化金属-半导体纳米结构为开发高效热电材料提供了巨大的潜力。

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  • 来源
    《Applied Physics Letters》 |2013年第8期|083115.1-083115.5|共5页
  • 作者

    Tuhin Shuvra Basu; Ronggui Yang; Suraj Joottu Thiagarajan; Siddhartha Ghosh; Stanislaw Gierlotka; Mallar Ray;

  • 作者单位

    School of Materials Science and Engineering, Bengal Engineering and Science University, Shibpur, Howrah 711103, West Bengal, India;

    Department of Mechanical Engineering, University of Colorado, Boulder, Colorado 80309, USA;

    Department of Mechanical Engineering, University of Colorado, Boulder, Colorado 80309, USA;

    Department of Electrical and Computer Engineering, University of Illinois at Chicago, Chicago, Illinois 60607, USA;

    Institute of High Pressure Physics, Polish Academy of Sciences, ul. Sokolowska 29/37, 01-142 Warsaw, Poland;

    School of Materials Science and Engineering, Bengal Engineering and Science University, Shibpur, Howrah 711103, West Bengal, India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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