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Significantly enhanced critical current density in Bi-2223/Ag multifilamentary tapes by hot pressing

机译:通过热压,Bi-2223 / Ag复丝带的临界电流密度显着提高

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Bi-2223/Ag multifilamentary tapes were fabricated using a hot-pressing technique to investigate its effect on grain connectivity and flux pinning. The critical current density in tapes after hot-pressing was doubled. J/sub c/ increased from 26000A/cm/sup 2/ to 56100A/cm/sup 2/ in a 19-filament tape. However, the critical current density in an applied magnetic field was not improved by hot-pressing. The fraction of strong links (I/sub C0//sup s//I/sub C0/) was improved from 47% to 68% in a 19-filament tape due to hot pressing. Microstructural analysis showed that hot-pressing improved grain connectivity, increased core density and reduced secondary phases.
机译:使用热压技术制造了Bi-2223 / Ag复丝带,以研究其对晶粒连接性和助焊剂钉扎的影响。热压后胶带中的临界电流密度增加了一倍。 J / sub c /在19根磁带中从26000A / cm / sup 2 /增加到56100A / cm / sup 2 /。然而,通过热压不能改善施加的磁场中的临界电流密度。由于热压,在19根丝带中,强链接(I / sub C0 // sup // I / sub C0 /)的比例从47%提高到68%。显微组织分析表明,热压改善了晶粒的连通性,增加了芯密度,减少了第二相。

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