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首页> 外文期刊>Applied Surface Science >Functions of Trilon~® P as a polyamine in copper chemical mechanical polishing
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Functions of Trilon~® P as a polyamine in copper chemical mechanical polishing

机译：Trilon〜®P作为多胺在铜化学机械抛光中的作用

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摘要

In this paper, as a representative of the polyamines, Trilon~® P was used as a critical additive in copper slurries to improve the copper chemical mechanical polishing (CMP) performance, and high copper removal rate (RR), low copper static etching rate (SER), low dishing and low dielectric erosion were realized by CMP tests on the copper patterned wafers. The chelating reactions between Trilon~® P and cupric ions are revealed, and it is found that the reaction product Cu-Trilon~® P complex has dual functions for copper RR and SER: the negative one is from the weak passivation and the lubrication while the positive one is from the complexation with cupric ions and the facilitation of (*OH) formation, and the final polishing result depends on the competition between the above two functions. In addition, the adsorption of Trilon~® P on the plasma enhanced tetraethylorthosilicate (PETEOS) surface helps form a lubricating thin film, which relieves the severe mechanical stress on the PETEOS pattern, and thus results in low dielectric erosion.
机译：本文以多胺为代表，将Trilon〜®P用作铜浆中的关键添加剂，以提高铜化学机械抛光（CMP）性能，高铜去除率（RR），低铜静态蚀刻率（SER），低凹陷和低介电腐蚀是通过对铜图案化晶圆进行CMP测试实现的。揭示了Trilon〜P和铜离子之间的螯合反应，发现反应产物Cu-Trilon〜P配合物对RR和SER铜具有双重功能：负的是弱钝化和润滑性。积极的一面是与铜离子的络合和（* OH）的形成，最后的抛光结果取决于上述两种功能之间的竞争。另外，在等离子体增强的原硅酸四乙酯（PETEOS）表面上吸附Trilon®P有助于形成润滑性薄膜，从而减轻了PETEOS图案上的严重机械应力，从而降低了介电腐蚀。

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  • 来源
    《Applied Surface Science》 |2014年第1期|265-274|共10页
  • 作者

    Liang Jiang; Yongqing Lan; Yongyong He; Yuzhuo Li; Jianbin Luo;

  • 作者单位

    State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China,Center for Advanced Materials Processing, Clarkson University, Potsdam, NY 13699, USA;

    Center for Advanced Materials Processing, Clarkson University, Potsdam, NY 13699, USA;

    State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China;

    Center for Advanced Materials Processing, Clarkson University, Potsdam, NY 13699, USA;

    State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China;

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  • 正文语种 eng
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  • 关键词

    Copper chemical mechanical polishing; Polyamine; Trilon~® P; Dishing; Dielectric erosion;

    机译：铜化学机械抛光;多胺;Trilon〜®P;菜;介电腐蚀;

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