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Physical and electrochemical study of platinum thin films deposited by sputtering and electrochemical methods

机译:溅射和电化学方法沉积铂薄膜的物理和电化学研究

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摘要

In this work platinum thin films deposited by sputtering and electrochemical methods were characterized through physical and electrochemical analysis. The as-grown platinum thin films were characterized through X-ray diffraction (XRD), atomic force microscopy (AFM); scanning electronic microscopy (SEM) and through electrochemical impedance spectroscopy (EIS) measurements. Structural studies indicated that platinum thin films were polycrystalline. Morphological characteristics were significantly affected by the substrate type and synthesis method. Finally the EIS analysis indicated that platinum films were electrochemically stable and present both low resistance of charge transfer and low series resistance; the equivalent circuit of platinum interface has been proposed.
机译:在这项工作中,通过物理和电化学分析对通过溅射和电化学方法沉积的铂薄膜进行了表征。通过X射线衍射(XRD),原子力显微镜(AFM)表征成膜的铂薄膜。扫描电子显微镜(SEM)和通过电化学阻抗谱(EIS)测量。结构研究表明,铂薄膜是多晶的。底物类型和合成方法显着影响了形态学特征。最后的EIS分析表明,铂薄膜是电化学稳定的,既具有低的电荷转移电阻又具有低的串联电阻。提出了铂接口的等效电路。

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  • 来源
    《Applied Surface Science》 |2011年第17期|p.7545-7550|共6页
  • 作者

    C.Quinones; W.Vallejo; F.Mesa;

  • 作者单位

    Universidad de Cartagena, Cartagena de Indias, Colombia,Departamento de Quimica, Universidad National de Colombia, Cra. 30 No 45-03, Bogota, Colombia;

    Departamento de Quimica, Universidad National de Colombia, Cra. 30 No 45-03, Bogota, Colombia;

    Departamento de Ciencias Basicas, Universidad Libre, Carrera 70 No 53-40, Bogota, Colombia;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    platinum; thin film; counter-electrode; dssc;

    机译:铂;薄膜;反电极dssc;

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