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Aminealkylthiol and dithiol self-assembly as adhesion promoter between copper substrate and epoxy resin

机译:氨基烷基硫醇和二硫醇自组装作为铜底材与环氧树脂之间的粘合促进剂

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摘要

To improve adhesion between copper and epoxy resin in printed circuit board, a roughness treatment of copper has been widely used. Nevertheless, new adhesion promoters have to be developed to face the miniaturization and sophistication of the electronic device. Self-assembled monolayers have met increasing interest in this field by using them as coupling agent between copper and the epoxy resin. This paper presents the deposition of an epoxy resin on copper modified by amine alkylthiol and dithiol monolayers and highlights the benefit brought by the monolayer in terms of adhesion. The chemical linkage between the amine SAMs and the epoxy function has been proved by the deposition on a short epoxy fragment, the 2-(4-fluorophenoxy-methyl)oxirane. The deposition of an epoxy resin mixed with amine curing agent has then been successfully achieved on amine terminated SAMs. The resulting polymer is homogeneous and well adherent on their surface, while the adhesion is lower on bare copper and not existing on methyl terminated SAMs. The formation of chemical bond Cu-S and N-epoxv is thus essential to increase the adhesion strength between copper and the polymer.
机译:为了提高印刷电路板中铜与环氧树脂之间的粘合性,已广泛使用铜的粗糙度处理。然而,必须开发新的粘合促进剂以面对电子设备的小型化和复杂化。通过将自组装单分子层用作铜和环氧树脂之间的偶联剂,自组装单分子层已在该领域引起了越来越多的关注。本文介绍了在胺烷基硫醇和二硫醇单层改性的铜上沉积环氧树脂的方法,并重点介绍了单层在粘合性方面带来的好处。胺SAM与环氧官能团之间的化学键合已通过在短的环氧片段2-(4-氟苯氧基-甲基)环氧乙烷上的沉积来证明。然后,已在胺封端的SAM上成功实现了与胺固化剂混合的环氧树脂的沉积。所得的聚合物是均匀的并且在其表面上具有良好的粘附性,而在裸铜上的粘附性较低,而在甲基封端的SAM上则不存在。因此,化学键Cu-S和N-环氧化合物的形成对于提高铜与聚合物之间的粘合强度至关重要。

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  • 来源
    《Applied Surface Science》 |2011年第24期|p.10686-10691|共6页
  • 作者单位

    Laboratory of Chemistry and Electrochemistry of Surfaces, Facultes Universitaires Notre-Dame de la Paix, Rue de Bruxelles 67, B-5000 Namur, Belgium,Fonds pour la Formation a la Recherche dans I'lndustrie et dans I'Agriculture, Rue d'Egmont 5, B-1000 Bruxelles, Belgium;

    Laboratory of Chemistry and Electrochemistry of Surfaces, Facultes Universitaires Notre-Dame de la Paix, Rue de Bruxelles 67, B-5000 Namur, Belgium;

    Laboratory of Chemistry and Electrochemistry of Surfaces, Facultes Universitaires Notre-Dame de la Paix, Rue de Bruxelles 67, B-5000 Namur, Belgium;

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  • 正文语种 eng
  • 中图分类
  • 关键词

    self-assembled monolayers aminoalkanethiol epoxy resin copper;

    机译:自组装单层氨基烷硫醇环氧树脂铜;

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