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Comparison of surface damage under the dry and wet impact: Molecular dynamics simulation

机译:干湿冲击下表面损伤的比较:分子动力学模拟

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摘要

Molecular dynamic simulation was applied in analyzing the difference of surface damage during the impact of a large silica cluster on a crystal silicon substrate in dry and wet condition, respectively. The simulation results show that the damage of silicon substrate under the dry impact is more severe than that under the wet impact. A reason is that the water film buffers the impact of the incident cluster at the init stage under the wet impact. The more important reason is that the water film might be solidified into a continuous thin film at the cluster deformation stage. So, the considerable great impact energy of the cluster will be absorbed by the water film and transformed into thermal dissipation of energy between the simulation ensemble and the water film.
机译:分子动力学模拟分别用于分析在干燥和潮湿条件下大型二氧化硅团簇对晶体硅基板的撞击过程中表面损伤的差异。仿真结果表明,干法冲击下硅衬底的损伤比湿法冲击下更严重。原因是水膜在湿冲击下在初始阶段缓冲了入射簇的冲击。更重要的原因是,水膜在团簇变形阶段可能会固化成连续的薄膜。因此,簇的相当大的冲击能量将被水膜吸收,并转换为模拟集合与水膜之间能量的热耗散。

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