机译:共水泥碳化钨基体上CVD金刚石和DLC膜的摩擦学行为和切削性能的研究
School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
HFCVD; diamond film; DLC film; WC-Co substrate; tribological behavior; cutting performance;
机译:共水泥碳化钨刀片上掺硼和硅掺杂金刚石膜的摩擦学性能和切削性能
机译:通过无定形SiC夹层具有高钴含量的碳化钨基材上CVD金刚石膜的粘附强度和摩擦学性能的增强
机译:流化床微加工和金刚石膜在硬质合金硬质合金硬质合金板上的HFCVD
机译:碳化钨衬底上金刚石膜的摩擦学研究
机译:氮化硅和硬质碳化钨工具上的微波辅助CVD金刚石涂层的分析和实验研究以及几种过渡金属上多晶金刚石的生长
机译:第三粒子对类金刚石碳膜摩擦学行为的影响
机译:流化床微加工和金刚石膜在硬质合金硬质合金硬质合金板上的HFCVD
机译:超硬涂层的摩擦学特性和应用:CVD金刚石,DLC和c-BN