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首页> 外文期刊>Applied Surface Science >Effect Of Thermal Annealing On Nanoimprinted Cu-ni Alloys Using Molecular Dynamics Simulation
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Effect Of Thermal Annealing On Nanoimprinted Cu-ni Alloys Using Molecular Dynamics Simulation

机译：分子动力学模拟研究热退火对纳米压印铜镍合金的影响

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摘要

The mechanical behaviors of nanoimprinted Cu-Ni alloys before and after annealing were studied using molecular dynamics simulation with a tight-binding potential. The results showed that when the punch is advancing, the punching force obtained from the simulation with a tight-binding potential is lower than with the Morse potential. During and after withdrawing the punch from the specimen, the adhesive phenomena are observed and the large residual stress in the Cu-Ni alloys is induced. During the annealing process, the internal energy of Cu-Ni alloys decreased with increasing the temperature and the component of Cu. In addition, comparing the maximum residual stress in the Cu-Ni alloys with and without annealing treatment, the stress is significantly released after annealing, especially in the higher component of Ni.
机译：使用具有紧密结合潜力的分子动力学模拟研究了纳米压印Cu-Ni合金退火前后的力学行为。结果表明，当打孔器前进时，从模拟中获得的具有紧密结合电位的打孔力低于在莫尔斯电势下的冲孔力。在从样品中取出冲头的过程中和之后，观察到粘附现象，并且在Cu-Ni合金中产生了很大的残余应力。在退火过程中，Cu-Ni合金的内能随温度和Cu含量的增加而降低。另外，比较在有和没有退火处理的Cu-Ni合金中的最大残余应力，该应力在退火后被显着释放，尤其是在较高含量的Ni中。

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