Thin layer laser bonding using spin-on-glass materials

Joohan Kim; Hyangtae Kim; Jae-Hoon Lee

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Thin layer laser bonding using spin-on-glass materials

机译：使用旋涂玻璃材料进行薄层激光焊接

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We developed and characterized a new laser bonding process with a nano adhesive layer for transparent materials. The adhesive is spin-coated on a glass substrate and cured locally with a focused laser beam. The minimum viscosity of the adhesive is very low, so that a thin layer only a few hundred nanometers thick can be coated on a cover substrate. Laser irradiation from a Nd:YAG laser system with a wavelength of 1064 nm is employed as the curing source for the localized nano layer bonding process. The measured thickness of the bonding layer is in the range of 400 nm to 3 μm. This process can be applied to the nano or micro bonding of various transparent systems such as flat panel displays, biochips, and heat-sensitive microelectronics. We present experimental results and discuss the process characteristics.

机译：我们开发并表征了一种新的激光粘合工艺，该工艺具有用于透明材料的纳米粘合剂层。将粘合剂旋涂在玻璃基板上，并用聚焦的激光束局部固化。粘合剂的最小粘度非常低，因此可以将仅几百纳米厚的薄层涂覆在覆盖基材上。来自Nd：YAG激光系统的波长为1064 nm的激光辐射被用作局部纳米层键合工艺的固化源。粘合层的测得厚度在400nm至3μm的范围内。该工艺可以应用于各种透明系统的纳米或微键合，例如平板显示器，生物芯片和热敏微电子。我们提供实验结果并讨论过程特征。

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来源
《Applied Surface Science》 |2008年第21期|p.6842-6848|共7页
作者
Joohan Kim; Hyangtae Kim; Jae-Hoon Lee;
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作者单位

Department of Mechanical Engineering, Seoul National University of Technology, Seoul, Zip: 139-743, South Korea;

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原文格式 PDF
正文语种 eng
中图分类应用物理学;
关键词
laser bonding; spin-on-glass; micro device;

机译：激光焊接;旋涂玻璃;微型设备;

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Thin layer laser bonding using spin-on-glass materials

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