Shave-off Vector Profiling For Tem Samples

M. Nojima; M. Fujii; Y. Ishizaki; M. Owari; Y. Nihei

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Shave-off Vector Profiling For Tem Samples

机译：Tem样本的剃除矢量分析

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This study aims to cross-check the same sample, the same part and the same piece by shave-off profiling and scanning transmission electron microscope (STEM) imaging. For cross-check analysis, a piece was picked up from a failed IC package which might cause electrochemical migration. Critical disagreement on each result was gradient curve on shave-off depth profiling from anode to cathode. In the same piece, shave-off profiling visualized a faint gradient of migrated ions which could not be observed by STEM imaging.

机译：这项研究旨在通过刮除轮廓和扫描透射电子显微镜（STEM）成像来交叉检查相同的样品，相同的零件和相同的零件。为了进行交叉检查分析，从有故障的IC封装中取出了一块，这可能会导致电化学迁移。每个结果的关键分歧在于从阳极到阴极的剃除深度轮廓上的梯度曲线。在同一张图中，剃除轮廓显示了迁移离子的微弱梯度，这是STEM成像无法观察到的。

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来源
《Applied Surface Science》 |2008年第4期|p.1400-1403|共4页
作者
M. Nojima; M. Fujii; Y. Ishizaki; M. Owari; Y. Nihei;
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作者单位

Research Institute for Science & Technology, Tokyo University of Science, 2641 Yamazaki, Noda, Chiba 278-8510, Japan;

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原文格式 PDF
正文语种 eng
中图分类应用物理学;
关键词
shave-off; cross-check; fib; sims;

机译：剃光;交叉检查;小纤维;模拟;

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专利

1. Shave-off depth profiling: Depth profiling with an absolute depth scale [J] . Nojima M, Maekawa A, Yamamoto T, Applied Surface Science . 2006,第19期

机译：刨除深度剖析：绝对深度比例的深度剖析
2. Shave-off depth profiling of transparent conductive films and data analysis of the profile [J] . Nakamura K, Ishikawa Y, Utsumi K, Surface and Interface Analysis: SIA: An International Journal Devoted to the Development and Application of Techniques for the Analysis of Surfaces, Interfaces and Thin Films . 2006,第12a13期

机译：透明导电膜的刮除深度轮廓分析和轮廓数据分析
3. SIMS Profiling and TEM of CVD Films on Multi-Filament Samples [J] . Dagmar Dietrich, Peter Willich, Sabine Stockel, Mikrochimica Acta: An International Journal for Physical and Chemical Methods of Analysis . 2000,第1a4期

机译：多丝样品上CVD膜的SIMS轮廓分析和TEM
4. A sample preparation technique to reveal the implant profile by TEM for IC failure analysis [C] . Ming Li, Chien Wei-Ting Kary, Shuqing Duan 2013 20th IEEE International Symposium on the Physical amp; Failure Analysis of Integrated Circuits . 2013

机译：一种样品制备技术，可通过TEM揭示植入物轮廓以进行IC失效分析
5. THE EFFECTS OF NONUNIFORMITY ON THE MODELING OF RESISTIVITY IN POLYCRYSTALLINE SILICON THIN FILMS (POLYSILICON, GRAIN BOUNDARY, DISTRIBUTION FUNCTION, DOPING PROFILE, TEM). [D] . KRULL, WADE ALLEN. 1985

机译：非均匀性对多晶硅硅薄膜（多晶硅，晶界，分布函数，掺杂曲线，TEM）中电阻率建模的影响。
6. A Fast and Implantation-Free Sample Production Method for Large Scale Electron-Transparent Metallic Samples Destined for MEMS-Based In Situ S/TEM Experiments [O] . Matheus A. Tunes, Cameron R. Quick, Lukas Stemper, 2021

机译：一种快速和植入的样品生产方法用于大型电子透明金属样品用于基于MEMS的原位S / TEM实验
7. Shave-Off Profiling for TEM Specimens [O] . Masashi Nojima 2015

机译：用于TEM标本的刮擦分析

Shave-off Vector Profiling For Tem Samples

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