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Fabrication of Cu nano particles by direct electrochemical reduction from CuO nano particles

机译:通过直接电化学还原CuO纳米粒子制备Cu纳米粒子

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In this report, Cu nano particles have been prepared by direct electrochemical reduction from CuO nano particles and the reduction mechanism was investigated. To investigate the reduction mechanism, CuO has been deposited on the AISI 430 by magnetron sputtering in various Ar/O_2 ratio and the cyclic voltammetry (CV) was performed in 0.5 M NaCl solution at 300 K. This result indicated that the oxygen from the CuO was ionized at -0.874 V (versus SCE) and reduced to Cu. To fabricate Cu nano particles, we employed CuO nano particles, which were prepared by a conventional mechanical milling, with a dc rectifier and the specific electrochemical cell. The structure of the films and nano particles were analyzed by XRD, SEM/EDS and XPS.
机译:在该报告中,通过直接电化学还原法从CuO纳米粒子制备了Cu纳米粒子,并研究了其还原机理。为了研究还原机理,通过磁控溅射以不同的Ar / O_2比将CuO沉积在AISI 430上,并在300 M的0.5 M NaCl溶液中进行了循环伏安(CV)。该结果表明,来自CuO的氧在-0.874 V(相对于SCE)下被离子化并还原为Cu。为了制造Cu纳米颗粒,我们使用了CuO纳米颗粒,该颗粒是通过常规的机械研磨,直流整流器和特定的电化学电池制备的。通过XRD,SEM / EDS和XPS分析了薄膜和纳米颗粒的结构。

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