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Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution

机译:Al对3.5%NaCl溶液中无铅Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga焊料的电化学腐蚀行为的影响

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The effect of Al on the electrochemical corrosion behaviour of Pb-free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution was investigated by using potentiodynamic polarization techniques. The X content in the solder varied from 0.1 to 3 wt.%. Polarization studies revealed that an increase in Al content upto 1.5 wt.% decreased the corrosion current density corrosion rate of the solder and shifted the corrosion potential (E-corr) towards more noble values. However, higher content of Al, i.e. 3 (wt.%) in the five-element solder enhanced the corrosion rate and resulted in a significant increase in the E-corr towards more negative values. Passivation behaviour was noticed in all the solders having varying Al content, but the passive film formed at 1.5 wt.% Al was most stable due to its low passivation current density (i(p)) and low critical current density (i(cc)) value in comparison to the other solders. XPS and Auger depth profile results revealed that the passive film consisted of oxides/hydroxides of Al and Zn formed on the surface of the solder with Sn being formed in the subsequent layer. Considerable aluminium segregation occurred towards the surface principally as Al2O3/Al(OH)(3) with increase in Al content to 1.5 wt.% in the five element solder. The formation of Al2O3 seemed to prevent the oxidation of zinc on the surface of the solder. (c) 2005 Elsevier B.V. All rights reserved.
机译:采用电位动力学极化技术研究了Al对无铅Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga焊料在3.5%NaCl溶液中的电化学腐蚀行为的影响。焊料中的X含量为0.1至3重量%。极化研究表明,将Al含量提高到1.5 wt。%会降低焊料的腐蚀电流密度腐蚀速率,并使腐蚀电位(E-corr)向更高的贵族值转移。然而,五元素焊料中较高的Al含量,即3(wt。%)提高了腐蚀速率,并导致E-corr显着增加,向着更大的负值。在所有具有不同Al含量的焊料中均观察到钝化行​​为,但由于Al的钝化电流密度(i(p))低且临界电流密度(i(cc)低),在Al含量为1.5 wt%的情况下形成的钝化膜最稳定。 )值与其他焊料相比。 XPS和俄歇深度剖面结果表明,钝化膜由在焊料表面上形成的Al和Zn的氧化物/氢氧化物组成,在随后的层中形成Sn。铝表面以Al2O3 / Al(OH)(3)的形式发生相当多的铝偏析,其中五元素焊料中的Al含量增加至1.5 wt。%。 Al2O3的形成似乎可以防止焊料表面锌的氧化。 (c)2005 Elsevier B.V.保留所有权利。

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