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首页> 外文期刊>Applied Surface Science >An investigation into the surface topology and thickness profile of functional ceramic spinel manganate sputtered, evaporated and screen-printed layers
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An investigation into the surface topology and thickness profile of functional ceramic spinel manganate sputtered, evaporated and screen-printed layers

机译：功能性尖晶石锰酸盐陶瓷溅射，蒸镀和丝网印刷层的表面拓扑和厚度分布的研究

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摘要

In this paper an atomic force microscopy and scanning electron microscopy analysis of the surface grain structure of negative temperature coefficient of resistance (NTCR) thermistor nickel manganate layers produced by radio frequency (RF) magnetron sputtering, electron-beam evaporation and screen-printing is presented. Thin sputtered and evaporated films exhibited a dense low porosity surface with evidence for grain alignment in a brick layer fashion, whereas thick screen-printed layers displayed perceptible surface porosity. The layer thicknesses and the thickness distributions were analysed by surface profileometry. The three different deposition techniques used for film production are compared and described in detail, including the paste production for screen-printing, deposition conditions and post-deposition annealing and sintering processes for all three techniques. The effects of the differences in the film production processes on the film microstructure are discussed. This is important, because differences in microstructure can result in variations in the resistivity versus temperature characteristics. (c) 2006 Elsevier B.V. All rights reserved.
机译：本文通过射频（RF）磁控溅射，电子束蒸发和丝网印刷的方法，对负温度系数（NTCR）热敏电阻锰酸镍层的表面晶粒结构进行了原子力显微镜和扫描电镜分析。 。溅射和蒸发的薄膜很薄，显示出致密的低孔隙率表面，并以砖层的形式显示出晶粒排列的迹象，而厚的丝网印刷层则表现出明显的表面孔隙率。通过表面轮廓测定法分析层厚度和厚度分布。比较并详细描述了用于薄膜生产的三种不同的沉积技术，包括用于丝网印刷的浆料生产，沉积条件以及所有这三种技术的沉积后退火和烧结工艺。讨论了薄膜生产工艺中的差异对薄膜微观结构的影响。这很重要，因为微观结构的差异会导致电阻率与温度特性的差异。 （c）2006 Elsevier B.V.保留所有权利。

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