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Development of copper coatings on ceramic powder by electroless technique

机译：化学镀技术开发陶瓷粉末上的铜涂层

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Electroless (EL) coating technique is one of the elegant ways of coating by controlling the temperature and pH of the coating bath in which there is no usage of electric current. EL nano-copper coating on ceramic particles of micron size is not reported. In this investigation, ceramic powders of similar to 100 mu m size have been coated with copper by EL technique in the pH and temperature ranges of 12-13.5 and 60-85 degrees C, respectively. The optimization of EL copper bath has been evaluated through the combination of process parameters like pH and temperature. The optimized value of pH is found to be 12.5 and temperature as 75 degrees C. The coated and uncoated powders have been subjected to microstructural studies by scanning electron microscope (SEM) and the phases present have been analyzed by X-ray diffraction. An attempt has been made to understand the bonding mechanism of coating. The adherence with the substrate is attributed to the chemical and mechanical bonding at the interface. A model has been suggested for the mechanical bonding effect at the interface. (c) 2005 Elsevier B.V. All rights reserved.
机译：化学（EL）镀膜技术是一种优雅的镀膜方法之一，它可以控制不使用电流的镀浴的温度和pH值。没有报道在微米尺寸的陶瓷颗粒上的EL纳米铜涂层。在这项研究中，已通过EL技术在pH和温度范围分别为12-13.5和60-85℃的范围内用铜涂覆了尺寸相似的100微米陶瓷粉。通过结合工艺参数（例如pH和温度）对EL铜浴的优化进行了评估。发现pH的最佳值为12.5，温度为75℃。涂覆的和未涂覆的粉末已经通过扫描电子显微镜（SEM）进行了微结构研究，并且存在的相已经通过X射线衍射进行了分析。试图了解涂层的结合机理。与基材的粘附性归因于界面处的化学和机械结合。已经提出了用于界面处机械结合效果的模型。 （c）2005 Elsevier B.V.保留所有权利。

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