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首页> 外文期刊>Applied Surface Science >Laser-induced site-selective silver seeding on polyimide for electroless copper plating
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Laser-induced site-selective silver seeding on polyimide for electroless copper plating

机译：激光诱导的聚酰亚胺上的定点银晶种用于化学镀铜

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摘要

Ag particles were generated on Ag+-doped polyimide film by laser direct writing, followed by selective copper deposition using the metallic silver particles as seeds. Laser irradiation caused in situ reduction and agglomeration of silver on the polyimide film. The copper lines were less uniform and compact with higher scanning velocity and the width of the deposited copper line could reach 25 mu m. Equations of the relationship between scanning velocity and connectivity of the deposited copper patterns have been derived. The process was characterised by AFM, XPS, SEM, and semiconductor characterisation system. (c) 2006 Elsevier B.V.. All rights reserved.
机译：通过激光直接写入在Ag +掺杂的聚酰亚胺薄膜上生成Ag颗粒，然后使用金属银颗粒作为种子进行选择性铜沉积。激光辐照导致聚酰亚胺膜上的银原位还原和聚集。铜线不均匀且致密，扫描速度较高，所沉积的铜线宽度可达到25μm。推导了扫描速度与沉积的铜图案的连通性之间的关系方程。该过程通过AFM，XPS，SEM和半导体表征系统进行了表征。 （c）2006 Elsevier B.V.。保留所有权利。

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