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首页> 外文期刊>Applied Surface Science >Study on chemical effects of H_2O_2 and glycine in the Copper CMP process using ReaxFF MD
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Study on chemical effects of H_2O_2 and glycine in the Copper CMP process using ReaxFF MD

机译：Reaxff MD研究H_2O_2和甘氨酸中H_2O_2和甘氨酸的化学效应

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摘要

ReaxFF MD simulation was employed to simulate the chemical mechanical polishing (CMP) process of copper in four different polishing slurries (pure H2O, aqueous H2O2, aqueous glycine and a mixture aqueous H2O2 and glycine) in order to investigate the microchemistry mechanism during the copper CMP process. Results indicate that the increment of H2O2 concentration can inhibit the adsorption of H2O on the copper surface and promote the dissociation of H2O. After adding glycine to polishing slurry, the adsorption of H2O on the copper surface is also inhibited and there are copper complex (CueC(2)H(5)O(2)N) forming on the copper surface. Copper atoms on the topmost surface are weaken under the action of H2O2 and glycine, which is beneficial to atoms removal. The amount of copper atoms removed is the least in pure water and the most in a mixture of aqueous H2O2 and glycine during the copper CMP process. In addition, the amount of copper atoms removed increases first and then decreases with the increment of H2O2 concentration. This work shows atomic insights into copper atoms removal under the combination of chemical and mechanical effects, which provides an effective method to choose CMP slurry.
机译：采用Reaxff MD模拟来模拟四种不同抛光浆料（纯H20，H 2 O 2，甘氨酸水溶液和混合物水溶液水溶液和甘氨酸水溶液）的化学机械抛光（CMP）方法，以便在铜CMP期间研究微量化学机制过程。结果表明，H 2 O 2浓度的增量可以抑制H2O对铜表面上的吸附，促进H2O的解离。在将甘氨酸添加到抛光浆料后，还抑制了H 2 O对铜表面上的吸附，并且在铜表面上形成铜络合物（Cuec（2）H（5）O（2）N）。顶部表面上的铜原子在H 2 O 2和甘氨酸的作用下削弱，这对于去除原子是有益的。除去的铜原子的量是纯水中最少的，最多的铜CMP过程中H 2 O 2水溶液和甘氨酸的混合物中。另外，除去铜原子的量首先增加，然后随着H 2 O 2浓度的增量降低。这项工作显示了在化学和机械效应的组合下铜原子去除的原子洞察，这提供了一种选择CMP浆料的有效方法。

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  • 来源
    《Applied Surface Science》 |2020年第1期|145262.1-145262.6|共6页
  • 作者

    Guo Xiaoguang; Yuan Song; Gou Yongjun; Wang Xiaoli; Guo Jiang; Jin Zhuji; Kang Renke;

  • 作者单位

    Dalian Univ Technol Key Lab Precis & Nontradit Machining Technol Minist Educ Dalian 116024 Peoples R China;

    Dalian Univ Technol Key Lab Precis & Nontradit Machining Technol Minist Educ Dalian 116024 Peoples R China;

    Dalian Univ Technol Key Lab Precis & Nontradit Machining Technol Minist Educ Dalian 116024 Peoples R China;

    Dalian Univ Technol Key Lab Precis & Nontradit Machining Technol Minist Educ Dalian 116024 Peoples R China;

    Dalian Univ Technol Key Lab Precis & Nontradit Machining Technol Minist Educ Dalian 116024 Peoples R China;

    Dalian Univ Technol Key Lab Precis & Nontradit Machining Technol Minist Educ Dalian 116024 Peoples R China;

    Dalian Univ Technol Key Lab Precis & Nontradit Machining Technol Minist Educ Dalian 116024 Peoples R China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    ReaxFF MD; CMP; Copper; H2O2; Glycine;

    机译：Reaxff MD;CMP;铜;H2O2;甘氨酸;

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