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首页> 外文期刊>Applied Surface Science >Improved dielectric and thermal properties of core-shell structured SiO_2/ polyolefin polymer composites for high-frequency copper clad laminates
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Improved dielectric and thermal properties of core-shell structured SiO_2/ polyolefin polymer composites for high-frequency copper clad laminates

机译:改进的芯壳结构SiO_2 /聚烯烃聚合物复合材料的介电和热性能,用于高频铜包层层压材料

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摘要

Core-shell structured SiO2 particles were added to polyolefin matrix to prepare copper clad laminates (CCLs) with high thermal conductivity, low dielectric loss (D-f) and low dielectric constant (D-k) for the 5G age. In this work, core-shell structured SiO2 particles with different shell thicknesses were fabricated by coating ethylenepropylene-dicyclopentadiene (EPDM) onto their surface. The effect of shell thickness (0, 6, 9 and 13 nm) on the properties of CCLs was investigated. CCLs, with a shell thickness of 13 nm EPDM@SiO2, achieved D-k = 3.57 and D-f = 0.0032 at 10 GHz and exhibited stable dielectric properties in a wide frequency range (3 GHz to 18 GHz). The as-obtained CCLs had a thermal conductivity of 0.56 W/(m.K), which is higher than that of the non-coated CCLs [0.46 W/(m.K)]. Moreover, the as-obtained CCLs showed good mechanical properties and solvent resistance. Hence, the as-obtained CCLs with surface rubberised SiO2 particles have a potential for use in high-frequency printed circuit boards (PCBs).
机译:将核 - 壳结构的SiO 2颗粒加入聚烯烃基质中,以制备具有高导热率,低介电损耗(D-F)和5G龄的低介电损耗(D-k)的铜包层层(CCL)。在这项工作中,通过将带乙烯 - 二环戊二烯(EPDM)涂覆到其表面上,制造具有不同壳厚度的核 - 壳结构SiO 2颗粒。研究了壳体厚度(0,6,9和13nm)对CCLS性质的影响。 CCLS,壳体厚度为13nm EPDM @ SiO 2,实现了10GHz的D-K = 3.57和D-F = 0.0032,并在宽频范围内显示出稳定的电介质特性(3GHz至18 GHz)。作为所得的CCLS的导热率为0.56W /(M.K),其高于未涂覆的CCLS [0.46W /(M.K)]。此外,AS获得的CCLS显示出良好的机械性能和耐溶剂性。因此,具有表面橡胶SiO2颗粒的AS获得的CCLS具有用于高频印刷电路板(PCB)的可能性。

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