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首页> 外文期刊>Arabian Journal for Science and Engineering >Wire Saw Process-Induced Surface Damage Characterization
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Wire Saw Process-Induced Surface Damage Characterization

机译：线锯加工引起的表面损伤表征

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摘要

Wire saw process is used to cut concrete, stone, ceramics and almost all kinds of brittle materials with low surface damage and high efficiency. Silicon wafers in semiconductor and photovoltaic industries are generally sliced using wire saw process. Wire saw process induces surface damage to the wafer surface which decreases the wafer quality and increases production costs due to post grinding and polishing. The formation of surface damage was investigated using bonded interface sectioning technique in this study. An experimental parametric study was conducted to relate the process parameters to wire bow angle, distributed wire load and surface damage depth. A non-dimensional damage index is defined which is a function of process parameters. Process recommendations are presented to increase the efficiency without increasing surface damage.
机译：线锯工艺用于切割混凝土，石材，陶瓷和几乎所有脆性材料，且表面损伤小，效率高。半导体和光伏行业中的硅晶片通常使用线锯工艺进行切片。线锯工艺对晶片表面造成表面损伤，由于后研磨和抛光，降低了晶片质量并增加了生产成本。在本研究中，使用粘结界面切片技术研究了表面损伤的形成。进行了实验参数研究，以将过程参数与线弓角，分布的线载荷和表面损伤深度相关联。定义了无量纲的破坏指数，该指数是过程参数的函数。提出了工艺建议，以提高效率而不增加表面损伤。

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