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Self-assembly for electronics

机译：电子产品组装

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摘要

Self-assembly, a process in which molecules, polymers, and particles are driven by local interactions to organize into patterns and functional structures, is being exploited in advancing silicon electronics and in emerging, unconventional electronics. Silicon electronics has relied on lithographic patterning of polymer resists at progressively smaller lengths to scale down device dimensions. Yet, this has become increasingly difficult and costly. Assembly of block copolymers and colloidal nanoparticles allows resolution enhancement and the definition of essential shapes to pattern circuits and memory devices. As we look to a future in which electronics are integrated at large numbers and in new forms for the Internet of Things and wearable and implantable technologies, we also explore a broader material set. Semiconductor nanoparticles and biomolecules are prized for their size-, shape-, and composition-dependent properties and for their solution-based assembly and integration into devices that are enabling unconventional manufacturing and new device functions.
机译：自组装，一种方法，其中分子，聚合物和颗粒由局部相互作用驱动以组织成图案和功能结构，在推进硅电子和新兴的非传统电子设备中被利用。硅电子依赖于聚合物抗蚀剂的光刻图案化，以逐渐较小的长度缩小装置尺寸。然而，这已经变得越来越困难且昂贵。嵌段共聚物和胶体纳米颗粒组装允许分辨率提高和对图案电路和存储器装置的必要形状的定义。当我们期待未来的未来，其中电子产品以大量集成以及以互联网和可穿戴技术的新形式集成，我们也探索了更广泛的材料集。半导体纳米颗粒和生物分子用于其尺寸，形状和组成依赖性，以及它们的溶液基组件和集成到能够实现非传统制造和新设备功能的装置中。

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  • 来源
    《MRS bulletin》 |2020年第10期|807-814|共8页
  • 作者

    Kagan Cherie R.; Hyeon Taeghwan; Kim Dae-Hyeong; Ruiz Ricardo; Tung Maryann C.; Wong H-S Philip;

  • 作者单位

    Univ Penn Elect & Syst Engn Mat Sci & Engn & Chem Philadelphia PA 19104 USA;

    Seoul Natl Univ Ctr Nanoparticle Res Inst Basic Sci Seoul South Korea|Seoul Natl Univ Sch Chem & Biol Engn Seoul South Korea;

    Seoul Natl Univ Ctr Nanoparticle Res Inst Basic Sci Seoul South Korea|Seoul Natl Univ Sch Chem & Biol Engn Seoul South Korea;

    Lawrence Berkeley Natl Lab Berkeley CA USA;

    Stanford Univ Elect Engn Stanford CA 94305 USA;

    Stanford Univ Dept Engn Stanford CA 94305 USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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