Brief review of silver sinter-bonding processing for packaging high-temperature power devices

著录项

• 来源
  《Chinese Journal of Electrical Engineering》 |2020年第3期|25-34|共10页
• 作者

  Haidong Yan; Peijie Liang; Yunhui Mei; Zhihong Feng;

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• 作者单位

  School of Mechanical and Electrical Engineering Guilin University of Electronic Technology Guilin 541004 China;

  Guangxi Key Lab of Manufacturing System and Advanced Manufacturing Technology Guilin 541004 China;

  School of Mechanical and Electrical Engineering Guilin University of Electronic Technology Guilin 541004 China;

  School of Materials Science and Engineering Tianjin University Tianjin 300072 China;

  Key Laboratory of Advanced Ceramics and Machining Technology of Ministry of Education Guilin 541004 China;

  National Key Lab of Application Specific Integrated Circuit Hebei Semiconductor Research Institute Shijiazhuang 050051 China;

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• 收录信息
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  Silver; Packaging; Silicon carbide; Thermal conductivity; Bonding; Micrometers; Films;

  机译：银;包装;碳化硅;导热率;粘合;微米;电影;