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首页> 外文期刊>Chinese science bulletin >Microstructural characteristics and electrical resistivity of rapidly solidified Co-Sn alloys
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Microstructural characteristics and electrical resistivity of rapidly solidified Co-Sn alloys

机译：快速凝固的Co-Sn合金的显微组织特征和电阻率

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摘要

The rapid solidification behavior of Co-Sn alloys was investigated by melt spinning method. The growth morphology of alpha Co phase in Co-20 percent Sn hypoeutectic alloy changes sensitively with cooling rate. A layer of columnar alpha Co dendrite forms near the roller side at low cooling rates. This region becomes small and disappears as the cooling rate increases and a kind of very fine homogeneous microstructure characterized by the distribution of equiaxed alpha Co dendrites in gamma Co_3Sn matrix is subsequently produced. For Co-34.2 percent Sn eutectic alloy, anomalous eutectic forms within the whole range of cooling rates. The increase of cooling rate has two obvious effects on both alloys: one is the microstructure refinement, and the other is that it produces more crystal defects to intensify the scattering of free electrons, leading to a remarkable increase of electrical resistivity. Under the condition that the grain boundary reflection coefficient r approaches 1, the resistivity of rapidly solidified Co-Sn alloys can be predicted theoretically.
机译：采用熔体纺丝法研究了Co-Sn合金的快速凝固行为。 Co-20％Sn亚共晶合金中αCo相的生长形态随冷却速率的变化而敏感地变化。在低冷却速率下，在辊侧附近会形成一层柱状α-Co枝晶。随着冷却速率的增加，该区域变小并消失，随后产生了一种非常精细的均匀微观结构，其特征是等轴αCo树枝状晶体在γCo_3Sn基体中的分布。对于钴含量为34.2％的锡共晶合金，在整个冷却速率范围内都会形成异常的共晶。冷却速率的提高对两种合金都有两个明显的影响：一种是微观组织的细化，另一种是它产生更多的晶体缺陷以增强自由电子的散射，从而导致电阻率的显着提高。在晶界反射系数r接近1的条件下，理论上可以预测出快速凝固的Co-Sn合金的电阻率。

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