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New epoxy resins for printed wiring board applications

机译：用于印刷线路板的新型环氧树脂

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Purpose - This paper seeks to give an overview of problems arising with the change to lead-free soldering and to give guidance on possible counter actions in the context of the chemical structure of the base material. Design/methodology/approach - The paper contains a number of correlations between different physical measurements and their impacts on real life processing conditions. The problem areas are highlighted and the corrective actions that need to be taken on the base materials are described. The impact of the choice of flame retardant on material properties is demonstrated. Findings - Results suggest that conventional resin systems seem to be still suitable for standard FR-4 applications with only a few reflow cycles. Higher thermally resistant products are necessary for more complex structures that require multiple reflow cycles. There are basically two ways to increase the thermal resistance. Replace dicyandiamide by a phenolic hardener or change to a bromine-free flame retardant. Both approaches are successful in raising the decomposition temperature, with the latter having the additional advantage of achieving better electrical performance and lower density. Originality/value - The value of the paper lies in its ability to provide guidance on the critical base material properties. It describes the change in physical properties that laminates will see when moving up in temperature to facilitate lead-free soldering. Selection criteria for base materials are given in order to neutralize the impact of the higher temperature.
机译：目的-本文旨在概述无铅焊接所带来的问题，并就基材化学结构方面的可能对策提供指导。设计/方法/方法-本文包含了不同物理量度及其对实际加工条件的影响之间的许多相关性。突出显示了问题区域，并描述了需要对基础材料采取的纠正措施。证明了选择阻燃剂对材料性能的影响。结果-结果表明，常规的树脂体系似乎仍然仅需几个回流周期即可适用于标准FR-4应用。对于需要多次回流循环的更复杂的结构，需要更高的耐热性产品。基本上有两种增加热阻的方法。用酚醛固化剂代替双氰胺，或改为无溴阻燃剂。两种方法都成功地提高了分解温度，后者具有获得更好的电性能和更低密度的额外优势。原创性/价值-论文的价值在于其对关键基础材料性能提供指导的能力。它描述了层压材料在温度升高以促进无铅焊接时会看到的物理性能变化。给出了基础材料的选择标准，以抵消较高温度的影响。

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