C4NP: Lead-Free and Low Cost Solder Bumping Technology for Electronics Packaging

Klaus Ruhmer; Eric Laine; Peter Gruber

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C4NP: Lead-Free and Low Cost Solder Bumping Technology for Electronics Packaging

机译：C4NP：电子封装的无铅低成本焊料凸块技术

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New electronics applications are pushing the boundaries when it comes to weight, compactness, reliability, cost, and high-speed performance in electronics packaging, even as environmental laws limit traditional materials. One way around these constraints—wafer bumping—has become a viable solution. Other bumping technologies are available, but these only solve a few aspects of the myriad challenges we face. So what makes C4NP unique? It cost effectively tackles existing applications while it is also compatible with new bump and Under Bump Metallurgy (UBM) materials.

机译：即使在环境法律限制传统材料的情况下，新的电子应用程序在重量，紧凑性，可靠性，成本和高速性能方面也在不断突破。解决这些限制的一种方法-晶圆碰撞-已成为可行的解决方案。还可以使用其他技术，但这些技术只能解决我们面临的众多挑战的几个方面。那么，什么使C4NP独一无二？它可以经济有效地解决现有应用，同时还与新型凸块和凸块下冶金（UBM）材料兼容。

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《Circuitree》 |2006年第8期|p.101215-1618|共5页
作者
Klaus Ruhmer; Eric Laine; Peter Gruber;
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SUSS MicroTec, Inc. (Tempe, AZ);

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原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
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1. Cost, production, and logistics implications of C4NP solder bumping [J] . Eric Laine Solid state technology . 2007,第1期

机译：C4NP焊料凸块的成本，生产和物流影响
2. Enhanced solder wettability of oxidized-copper with lead-free solder via Ar-H_2 plasmas for flip-chip bumping: the effects of H_2 flow rates [J] . Y. S. Lin, W. J. Lin, L. Y. Chiu Soldering & Surface Mount Technology . 2012,第3期

机译：通过Ar-H_2等离子体增强无铅焊料对氧化铜的焊料润湿性：倒装芯片凸点：H_2流速的影响
3. Nondestructive Evaluation of Poor-Wetted Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique [J] . Gong, J., Ume, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2013,第8期

机译：使用激光超声和干涉技术对球形阵列封装中润湿不良的无铅焊料凸点进行无损评估
4. C4NP: LEAD-FREE AND LOW COST SOLDER BUMPING TECHNOLOGY FOR FLIP CHIP AND WLCSP [C] . Klaus Ruhmer, Daniel Fleming, Peter Gruber Pan Pacific Microelectronics Symposium . 2006

机译：C4NP：倒装芯片和WLCSP的无铅低成本焊接技术
5. Wetting behaviors and interfacial reactions of lead-containing and lead-free solder alloys on gold, palladium, nickel foils, leadframes, and under-bump thin film metallizations in electronic packaging. [D] . Kim, Patrick Gu-Ho. 1998

机译：含铅和无铅焊料合金在电子包装中的金，钯，镍箔，引线框架和凸块下的薄膜金属上的润湿行为和界面反应。
6. Structure and properties of Sn-Cu lead-free solders in electronics packaging [O] . Meng Zhao, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子包装中的Sn-Cu无铅焊料的结构和性能
7. Maskless Screen Printing Process using Solder Bump Maker (SBM) for Low-cost, Fine-pitch Solder-on-Pad (SoP) Technology [O] . Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae, 2013

机译：无掩模丝网印刷工艺使用焊料凸块制造商（SBM）用于低成本，细大螺距焊垫（SOP）技术

C4NP: Lead-Free and Low Cost Solder Bumping Technology for Electronics Packaging

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