Built-in Reliability: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead-Free Laminate Materials

Michael Carano; Lee Burger

首页> 外文期刊>Circuitree >Built-in Reliability: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead-Free Laminate Materials

【24h】

Built-in Reliability: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead-Free Laminate Materials

机译：内置的可靠性：用于高频和无铅层压材料的去污和金属化工艺的优化

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

PWB fabricators and end users must manage ever-increasing complexities in PWB design, technology requirements and long-term reliability. It is critical that key processes such as desmear and electroless copper provide optimum reliability through a defined process window. This is important because the designer selects the interconnect technology and feature sizes required for the intended application. These various selections including the resin material chosen, impact the PWB reliability.

机译：PWB制造商和最终用户必须管理PWB设计，技术要求和长期可靠性方面日益复杂的问题。至关重要的是，诸如去污和化学镀铜之类的关键工艺必须通过定义的工艺窗口提供最佳的可靠性。这很重要，因为设计人员会选择目标应用所需的互连技术和功能尺寸。这些各种选择，包括所选的树脂材料，都会影响PWB的可靠性。

著录项

来源
《Circuitree》 |2006年第9期|p.10121416|共4页
作者
Michael Carano; Lee Burger;
展开▼
作者单位

Electrochemicals Inc.;

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
关键词

相似文献

外文文献
中文文献
专利

1. Topology optimization of conduction path in laminated metals composite materials [J] . Cheng Chin-Hsiang, Chen Yen-Fei International Journal of Thermal Sciences . 2015,第Null期

机译：叠层金属复合材料导电路径的拓扑优化
2. Pressure Effects on Lead-Free Metal Halide Perovskites: a Route to Design Optimized Materials for Photovoltaics [J] . Marta Morana, Lorenzo Malavasi Solar RRL . 2021,第11期

机译：对无铅金属卤化物钙质的压力影响：设计优化材料的光伏电阻
3. Frequency optimization of laminated skewed open cylindrical shells : Science and Engineering of Composite Materials [J] . Umut Topal, ümit Uzman Science and Engineering of Composite Materials . 2011,第3期

机译：叠层斜开圆柱壳的频率优化：复合材料科学与工程
4. Building Reliability into the PWB: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead Free Laminate Materials [C] . Michael Carano, Lee Burger IPC Printed Circuits Expo, Apex, and the Designers Summit vol.2; 20060205-10; Anaheim,CA(US) . 2006

机译：增强PWB的可靠性：优化用于高频和无铅层压材料的去污和金属化工艺
5. Electronics assembly, rework, and reliability evaluation using lead-free soldering materials, halogen-free laminate materials, and surface finishes with nanomaterials. [D] . Morose, Gregory J. 2008

机译：使用无铅焊接材料，无卤素层压板材料以及纳米材料的表面光洁度进行电子组装，返工和可靠性评估。
6. The Cs2AgRhCl6 Halide Double Perovskite: A Dynamically Stable Lead-Free Transition-Metal Driven Semiconducting Material for Optoelectronics [O] . Pradeep R. Varadwaj, Helder M. Marques 2020

机译：CS2AGRHCL6卤化物双钙钛矿：用于光电子的动态稳定的无铅过渡金属驱动半导体材料
7. Reliability-oriented materials design of fiber reinforced composite laminates. Formulation of reliability model of unidirectionally fiber reinforced laminates. [O] . Hidetoshi NAKAYASU, Zenichiro MAEKAWA 1989

机译：纤维增强复合材料层压材料的可靠性型材料设计。单向纤维增强层压板可靠性模型的制定。

Built-in Reliability: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead-Free Laminate Materials

摘要

著录项

相似文献

相关主题

期刊订阅