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>There's more than meets the eye in sonic-based surface preparation Stay on top of process variables and the evolving understanding of sonics when setting up and maintaining ultrasonic and megasonic cleaning systems
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There's more than meets the eye in sonic-based surface preparation Stay on top of process variables and the evolving understanding of sonics when setting up and maintaining ultrasonic and megasonic cleaning systems
Cleaning by the interaction of sound with liquid―ultrasonics and megasonics―is an ongoing source of inspiration and controversy. Ultrasonics and megasonics are not distinct or competing techniques but are actually a continuum. Both are based on sound waves traveling through liquid, producing cycles of compression and rarefaction. Vapor-filled bubbles result from tears in the liquid. The differences between ultrasonics and megasonics are in the frequencies of these sound waves. At lower ultrasonic frequencies, cavitation bubbles (actually vacuum voids) are relatively transient, growing then imploding with tremendous localized force and heat. At the higher frequencies associated with megasonic cleaning, bubbles are smaller and more stable. In megasonic cleaning, other forces such as acoustic streaming are more important; its action is directional―line-of-sight―and more suited to wafer fabrication. Ultrasonic cleaning produces a multi-directional "surround-sound," allowing cleaning of blind holes and complex components.
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