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首页> 外文期刊>Components, Packaging and Manufacturing Technology, IEEE Transactions on >A Novel Method to Fabricate a Thick-Film Cu Electrode Fired in Air Through Printing Al Electrode and Reduction-Oxidation Substitution Reaction
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A Novel Method to Fabricate a Thick-Film Cu Electrode Fired in Air Through Printing Al Electrode and Reduction-Oxidation Substitution Reaction

机译：通过印刷Al电极和还原 - 氧化取代反应制造在空气中焙烧的厚膜Cu电极的新方法

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摘要

The thick-film conductor pastes that are applied most widely are Ag and Cu due to their high conductivity. Ag paste can be sintered in air to have high conductivity, but its disadvantage is the overly high cost. Contrarily, although Cu thick paste is not expensive in terms of materials, Cu thick-film paste must be sintered in a reducing atmosphere to obtain high conductivity, which leads to high processing costs. A novel method for fabricating the base metal electrode Cu in an air atmosphere for high-temperature firing was successfully developed based on thick-film screen-printing Al pastes utilizing a reduction-oxidation substitution reaction. To make an excellent Cu electrode that can be substituted for a thick-film Al electrode, Al paste with high solid content, a large Al powder particle size, a CuSO4 solution with low pH, high temperature, and proper soaking time are all positive parameters. The first thick-film screen-printing Cu electrode with high conductivity (>10(-6) Omega), which is comparable with a thick-film Ag electrode, was successfully fabricated in air firing instead of reducing atmosphere firing.
机译：厚膜导体浆料最广泛的是Ag和Cu由于它们的导电性高。 Ag浆料可以在空气中烧结以具有高导电性，但其缺点是过于高成本。相反，虽然Cu厚浆料在材料方面不昂贵，但是Cu厚膜浆料必须在还原气氛中烧结以获得高导电性，这导致高加工成本。利用还原氧化取代反应，成功地开发了一种用于在空气气氛中制造基础金属电极Cu的新方法，用于高温烧制。为了使可以代替厚膜Al电极，具有高固体含量的Al浆料的优异Cu电极，大的Al粉末粒度，具有低pH，高温和适当浸泡时间的CusO4溶液是所有阳性参数。具有高导电率（> 10（-6）ω）的第一厚膜丝网印刷Cu电极，其与厚膜Ag电极相当，在空气烧制中成功制造，而不是降低大气烧制。

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