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首页> 外文期刊>Components, Packaging and Manufacturing Technology, IEEE Transactions on >The Study of the Polydispersivity Effect on the Thermal Conductivity of Particulate Thermal Interface Materials by Finite Element Method
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The Study of the Polydispersivity Effect on the Thermal Conductivity of Particulate Thermal Interface Materials by Finite Element Method

机译：有限元法研究多分散性对颗粒热界面材料导热系数的影响

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Thermal interface materials (TIMs) are particulate composite materials widely used in the microelectronics industry to reduce the thermal resistance between the device and the heat sink. Predictive modeling using fundamental physical principles is critical to developing new TIMs, since it can be used to quantify the effect of polydispersivity, volume fraction and arrangements on the effective thermal conductivity. A random network model that can efficiently capture the near-percolation transport in these particle-filled systems was developed by the authors, which can take into account the interparticle interactions and random size distributions. In this paper, a Java-based code is used to generate the microstructures at different volume fraction and different particle-size distribution (PSD). COMSOL was used to investigate the impact of polydispersivity on the effective thermal conductivity of particulate TIMs. The log-normal distribution was used to capture the filler PSD. From the simulation results, there exists an optimum value of the polydispersivity which has the largest thermal conductivity for a given volume fraction.
机译：热界面材料（TIMs）是微粒复合材料，广泛用于微电子工业中，以减小设备与散热器之间的热阻。使用基本的物理原理进行预测建模对于开发新的TIM至关重要，因为它可以用于量化多分散性，体积分数和排列方式对有效热导率的影响。作者开发了一个可以有效捕获这些充满粒子的系统中近渗流传输的随机网络模型，该模型可以考虑粒子间的相互作用和随机尺寸分布。在本文中，基于Java的代码用于生成不同体积分数和不同粒径分布（PSD）的微观结构。 COMSOL用于研究多分散性对颗粒TIM的有效导热率的影响。对数正态分布用于捕获填充物PSD。从模拟结果来看，对于给定的体积分数，存在具有最大导热率的多分散性的最佳值。

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