Effect of Epoxy Molding Compound on the Electrical Performance of Microelectronic Devices

Herbsommer J. A.

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Effect of Epoxy Molding Compound on the Electrical Performance of Microelectronic Devices

机译：环氧模塑化合物对微电子器件电性能的影响

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摘要

The epoxy mold compound (EMC) used in encapsulated microelectronic devices affects the thermal, electrical and mechanical performance of the devices. Although many studies have been conducted to test the reliability, thermal and mechanical aspects of the problem not much literature can be found analyzing the impact of the mold compound on the electrical performance of the devices. In this paper we present the results of carefully designed experiments that evaluate the effects of the EMC in the electrical performance of high-power high-frequency laterally diffused metal oxide silicon transistors.

机译：封装微电子器件中使用的环氧模塑化合物（EMC）影响器件的热，电和机械性能。尽管已经进行了许多研究来测试可靠性，但是对于该问题的热学和机械方面，并没有太多的文献分析模塑料对器件电性能的影响。在本文中，我们介绍了精心设计的实验结果，这些实验评估了EMC对大功率高频横向扩散金属氧化物硅晶体管的电性能的影响。

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《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 |2012年第8期|p.1293-1297|共5页
作者
Herbsommer J. A.;
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正文语种 eng
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Device; epoxy mold compound (EMC); packaging; semiconductor;

机译：装置;环氧模塑料（EMC）;包装;半导体;

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专利

1. Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor [J] . NAOKI MURAKI, NOBUHIRO MATOBA, TAKAYUKI HIRANO, Applied Spectroscopy: Society for Applied Spectroscopy . 2004,第2期

机译：使用荧光传感器的球栅阵列微电子封装中环氧树脂模塑料的残余应力图
2. Yield Stress and Rheological Characterization of the Low Shear Zone of an Epoxy Molding Compound for Encapsulation of Semiconductor Devices [J] . Masaki Yoshii Polymer engineering and science . 2008,第4期

机译：半导体器件封装用环氧模塑化合物低剪切区的屈服应力和流变特性
3. Development of Biphenyl Epoxy Type Molding Compound for Surface Mount Devices [J] . Shiro Honda, Masayuki Tanaka, Yasushi Sawamura, 日本化学会誌. 化学と工业化学 . 2001,第9期

机译：用于表面贴装器件的联苯环氧型模塑料的开发
4. Compression Molding Encapsulants for Wafer-Level Embedded Active Devices: Wafer Warpage Control by Epoxy Molding Compounds [C] . Kihyeok Kwon, Yoonman Lee, Junghwa Kim, IEEE Electronic Components and Technology Conference . 2017

机译：晶圆级嵌入式有源器件的压模密封胶：通过环氧树脂模塑料控制晶圆翘曲
5. The measurement of ion diffusion in epoxy molding compounds used to encapsulate microelectronic devices. [D] . Lantz, Leon, II. 2003

机译：用于封装微电子器件的环氧模塑化合物中离子扩散的测量。
6. Corrigendum: Active layers of high-performance lead zirconate titanate at temperatures compatible with silicon nano- and microelectronic devices [O] . Iñigo Bretos, Ricardo Jiménez, Monika Tomczyk, -1

机译：勘误：在与硅纳米和微电子器件兼容的温度下高性能锆钛酸铅钛酸盐的活性层
7. Advanced technology of epoxy molding compounds production and strength characteristics of developed epoxy molding compounds [O] . Sh. I. Gemuev, A.I. Gemuev 2016

机译：环氧成型化合物的先进技术，发育环氧树脂成型化合物的生产和强度特性
8. Characterizaion of a Kevlar-Filled Epoxy Molding Compound. [R] . mcfarland, j. w. 1979

机译：Kevlar填充环氧模塑料的表征。

Effect of Epoxy Molding Compound on the Electrical Performance of Microelectronic Devices

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